发明授权
- 专利标题： Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chip
- 专利标题（中）： 包括模塑复合层的半导体器件与半导体芯片的表面形成公共平面
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申请号： US12904628申请日： 2010-10-14
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公开(公告)号： US08330273B2公开(公告)日： 2012-12-11
- 发明人: Markus Brunnbauer , Jens Pohl , Rainer Steiner
- 申请人： Markus Brunnbauer , Jens Pohl , Rainer Steiner
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Dicke, Billig & Czaja, PLLC
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
A semiconductor device and method is disclosed. In one embodiment, the method includes placing a first semiconductor over an electrically conductive carrier. The first semiconductor is covered with a molding compound. A through hole is formed in the molding compound. A first material is deposited in the through hole.
公开/授权文献
- US20110024915A1 SEMICONDUCTOR DEVICE 公开/授权日：2011-02-03
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