Invention Grant
- Patent Title: Tire-wheel assembly and disassembly method for the same
- Patent Title (中): 轮胎组装和拆卸方法相同
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Application No.: US12829797Application Date: 2010-07-02
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Publication No.: US08333437B2Publication Date: 2012-12-18
- Inventor: Jun Matsuda , Keisuke Chino
- Applicant: Jun Matsuda , Keisuke Chino
- Applicant Address: JP
- Assignee: The Yokohama Rubber Co., Ltd.
- Current Assignee: The Yokohama Rubber Co., Ltd.
- Current Assignee Address: JP
- Agency: Thorpe North & Western LLP
- Priority: JP2009-160163 20090706
- Main IPC: B60C15/036
- IPC: B60C15/036 ; B60C25/01

Abstract:
A tire-wheel assembly and disassembly method is disclosed wherein relative shifting of a tire and a wheel when braking and/or cornering can be suppressed without negatively affecting tire replacement workability. Specifically, a tire-wheel assembly has a wheel constructed from an electrically conductive material and a tire assembled on an outer peripheral side of the wheel, wherein an electrically conductive layer is formed on at least a part of a wheel contact surface of the tire, and an electrically debonding adhesive comprising an ionic liquid is interposed between the electrically conductive layer of the tire and the wheel. When disassembling this tire-wheel assembly, the tire is removed from the wheel after voltage is applied between the wheel and the electrically conductive layer of the tire and electricity is passed through the electrically debonding adhesive.
Public/Granted literature
- US20110003920A1 TIRE-WHEEL ASSEMBLY AND DISASSEMBLY METHOD FOR THE SAME Public/Granted day:2011-01-06
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