Invention Grant
US08344522B2 Solder structure, method for forming the solder structure, and semiconductor module including the solder structure
失效
焊接结构，形成焊料结构的方法以及包括焊料结构的半导体模块
- Patent Title: Solder structure, method for forming the solder structure, and semiconductor module including the solder structure
- Patent Title (中): 焊接结构，形成焊料结构的方法以及包括焊料结构的半导体模块
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Application No.: US12935864Application Date: 2009-03-18
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Publication No.: US08344522B2Publication Date: 2013-01-01
- Inventor: Hideki Mizuhara , Hajime Kobayashi , Toshiya Shimizu
- Applicant: Hideki Mizuhara , Hajime Kobayashi , Toshiya Shimizu
- Applicant Address: JP Osaka
- Assignee: Sanyo Electric Co., Ltd.
- Current Assignee: Sanyo Electric Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2008-092111 20080331
- International Application: PCT/JP2009/055318 WO 20090318
- International Announcement: WO2009/122912 WO 20091008
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/48 ; H01L29/40
Abstract:
The invention provides a solder structure which is least likely to develop Sn whiskers and a method for forming such a solder structure. The solder structure includes an Sn alloy capable of a solid-liquid coexistent state and an Au (or Au alloy) coating covering at least part of the surface of the Sn alloy. The Au covering is a film that covers and coats at least part of the surface of the Sn alloy. As a preferable mode, the Au coating forms a netlike structure on the surface of the Sn alloy. The thickness of the Au coating is, for instance, 1 to 5 μm.
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