发明授权
- 专利标题： Structure with electronic component mounted therein and method for manufacturing such structure
- 专利标题（中）： 安装有电子部件的结构及其制造方法
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申请号： US12675080申请日： 2008-10-21
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公开(公告)号： US08345444B2公开(公告)日： 2013-01-01
- 发明人: Shigeaki Sakatani , Koso Matsuno , Atsushi Yamaguchi , Hidenori Miyakawa , Mikiya Ueda
- 申请人： Shigeaki Sakatani , Koso Matsuno , Atsushi Yamaguchi , Hidenori Miyakawa , Mikiya Ueda
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： McDermott Will & Emery LLP
- 优先权： JP2007-284975 20071101; JP2007-290308 20071108
- 国际申请： PCT/JP2008/002975 WO 20081021
- 国际公布： WO2009/057259 WO 20090507
- 主分类号： H05K1/11
- IPC分类号： H05K1/11
摘要：
A structure with electronic component mounted therein includes a wiring board on which an electronic component is mounted at least on its first face, resin provided at least between the electronic component and the wiring board, and a plurality of holes formed in the wiring board at region corresponding to a mounting position of the electronic component. The holes are filled with the resin. This suppresses warpage of the structure with electronic component mounted therein, and also improves reliability by reducing a stress applied to a bonding section between the wiring board and the electronic component.
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