Invention Grant
- Patent Title: Circuit enhancement by multiplicate-layer-handling circuit simulation
- Patent Title (中): 通过多层处理电路仿真的电路增强
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Application No.: US13193721Application Date: 2011-07-29
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Publication No.: US08347259B1Publication Date: 2013-01-01
- Inventor: Pavan Y. Bashaboina , James A. Culp
- Applicant: Pavan Y. Bashaboina , James A. Culp
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Yuanmin Cai
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Critical circuit blocks are identified in a chip design layout, and are marked by a marker layer identifying a marked region. Multiplicate layers are generated for each critical circuit block within each marked region. Each multiplicate layer includes a different type of variant for each identified critical circuit block. The different types of variants correspond to different types of optimization goals to address different issues in circuit performance. Circuit simulation is performed with each type of variants in combination with adjacent circuit blocks as provided in original design. In each marked region, the results of the circuit simulations are evaluated to determine an optimal type among the variants. The optimal type is retained in each marked region, thereby providing a chip design layout in which various marked regions can include different types of variant circuit blocks to provide local circuit optimization.
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