发明授权
- 专利标题: Silicon carbide semiconductor device and method for manufacturing the same
- 专利标题(中): 碳化硅半导体器件及其制造方法
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申请号: US12921250申请日: 2009-03-04
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公开(公告)号: US08350270B2公开(公告)日: 2013-01-08
- 发明人: Shoyu Watanabe , Shuhei Nakata , Kenichi Ohtsuka
- 申请人: Shoyu Watanabe , Shuhei Nakata , Kenichi Ohtsuka
- 申请人地址: JP Tokyo
- 专利权人: Mitsubishi Electric Corporation
- 当前专利权人: Mitsubishi Electric Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2008-057696 20080307
- 国际申请: PCT/JP2009/000965 WO 20090304
- 国际公布: WO2009/110229 WO 20090911
- 主分类号: H01L29/161
- IPC分类号: H01L29/161
摘要:
A silicon carbide MOSFET that exhibits a high source-to-drain withstand voltage and that involves a smaller difference between gate-to-drain capacitance achieved in an activated state and gate-to-drain capacitance achieved in a deactivated state. A silicon carbide drift layer of a first conductivity type is provided on a silicon carbide substrate of a first conductivity type; a pair of base regions are provided in a surface layer portion of the silicon carbide drift layer and exhibit a second conductivity type; a pair of source regions are provided in interiors of surface layer portions of the pair of base regions and exhibit a first conductivity type; and semi-insulating regions are provided between the silicon carbide substrate and the pair of base regions.
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