Invention Grant
- Patent Title: Digital device interconnect interface and system
- Patent Title (中): 数字设备互连接口和系统
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Application No.: US13246365Application Date: 2011-09-27
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Publication No.: US08352657B2Publication Date: 2013-01-08
- Inventor: Mark R. Bohm
- Applicant: Mark R. Bohm
- Applicant Address: US NY Hauppauge
- Assignee: Standard Microsystems Corporation
- Current Assignee: Standard Microsystems Corporation
- Current Assignee Address: US NY Hauppauge
- Agency: Meyertons Hood Kivlin Kowert & Goetzel, P.C.
- Agent Jeffrey C. Hood
- Main IPC: G06F13/42
- IPC: G06F13/42

Abstract:
A simple data transfer mechanism may be combined with static state bus signaling to replace a USB with a digital serial interconnect bus (DSIB). This may eliminate various pull-up/pull-down resistors required in USB, and enable the DSIB to operate with little or no leakage current when the bus is in an idle state, or data transmission state. All required functionality may be implemented using only two signal pins. The DSIB may also enable silicon solutions for high speed USB that do not require a PLL, since the clock may be provided by the transmission source and may thus not need to be recovered from the serial data stream. The DSIB may provide an easy reuse mechanism for USB silicon by enabling a designer to remove the analog PHY and replace it with a serial digital I/O transfer mechanism, while retaining the IP's USB timers, and other protocol specific features.
Public/Granted literature
- US20120137032A1 Digital Device Interconnect Interface and System Public/Granted day:2012-05-31
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