Invention Grant
- Patent Title: Method for producing porous microneedles and their use
- Patent Title (中): 生产多孔微针的方法及其应用
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Application No.: US12227509Application Date: 2007-04-27
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Publication No.: US08354033B2Publication Date: 2013-01-15
- Inventor: Dick Scholten , Julia Cassemeyer , Michael Stumber , Franz Laermer , Ando Feyh , Christian Maeurer
- Applicant: Dick Scholten , Julia Cassemeyer , Michael Stumber , Franz Laermer , Ando Feyh , Christian Maeurer
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102006028781 20060623
- International Application: PCT/EP2007/054175 WO 20070427
- International Announcement: WO2007/147671 WO 20071227
- Main IPC: B44C1/22
- IPC: B44C1/22 ; C25F3/00

Abstract:
A method for producing porous microneedles (10) situated in an array on a silicon substrate includes: providing a silicon substrate, applying a first etching mask, patterning microneedles using a DRIE process (“deep reactive ion etching”), removing the first etching mask, at least partially porosifying the Si substrate, the porosification beginning on the front side of the Si substrate and a porous reservoir being formed.
Public/Granted literature
- US20090200262A1 Method for Producing Porous Microneedles and their Use Public/Granted day:2009-08-13
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