Invention Grant
- Patent Title: Wired circuit board and producing method thererof
- Patent Title (中): 有线电路板及其制造方法
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Application No.: US12216511Application Date: 2008-07-07
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Publication No.: US08354597B2Publication Date: 2013-01-15
- Inventor: Takahiko Yokai , Toshiki Naito
- Applicant: Takahiko Yokai , Toshiki Naito
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2007-177510 20070705
- Main IPC: H05K1/03
- IPC: H05K1/03 ; G11B5/48 ; H05K1/00
Abstract:
A wired circuit board includes a metal supporting board having at least one depressed portion, a conductive portion embedded in the at least one depressed portion and formed of a material having a higher conductivity than that of the metal supporting board, an insulating layer formed on the metal supporting board so as to cover the conductive portion, and a plurality of wires formed on the insulating layer in mutually spaced-apart relation so as to oppose to the conductive portion.
Public/Granted literature
- US20090008137A1 Wired circuit board and producing method thererof Public/Granted day:2009-01-08
Information query
