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公开(公告)号：US08105644B2
公开(公告)日：2012-01-31
申请号：US12043460
申请日：2008-03-06
Applicant: Takahiko Yokai
Inventor： Takahiko Yokai
CPC classification number: H05K3/1225 , H05K3/3484
Abstract: A screen plate having a plurality of openings is placed on a suspension substrate in which a plurality of conductive pads are formed. Conductive paste is moved in one direction on an upper surface of the screen plate, so that the conductive paste is applied onto the conductive pads through the openings. A recess that is inwardly bent is formed in each of the openings of the screen plate.
Abstract translation: 具有多个开口的筛板被放置在其上形成有多个导电垫的悬置基板上。 导电浆料在筛板的上表面上沿一个方向移动，使得导电浆料通过开口施加到导电垫片上。 在筛板的每个开口中形成向内弯曲的凹部。
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公开(公告)号：US20110020598A1
公开(公告)日：2011-01-27
申请号：US12894409
申请日：2010-09-30
Applicant: Takahiko YOKAI
Inventor： Takahiko YOKAI
IPC: B32B3/10
CPC classification number: H05K3/1216 , H05K3/0052 , H05K3/0097 , H05K2203/0165 , H05K2203/082 , Y10T29/49155 , Y10T428/24273
Abstract: A plurality of through holes having an equal size are formed in an underlay substrate. Positions of the plurality of through holes are suitably set according to the shape of a substrate sheet. Specifically, an equal number of through holes are formed in each of end blank corresponding regions that, when the substrate sheet and the underlay substrate are overlapped with each other, overlap with end blank regions of the substrate sheet, of the underlay substrate. In addition, the through holes are formed at equal spacing in portions excluding the end blank corresponding regions in a blank corresponding region, which overlaps with a blank region of the substrate sheet, of the underlay substrate.
Abstract translation: 具有相同尺寸的多个通孔形成在底层基板中。 多个贯通孔的位置根据基板的形状适当设定。 具体而言，在底板对应区域中，当底板和底层基板彼此重叠时，与衬底基板的基板的端部空白区域重叠，形成相同数量的通孔。 此外，在底衬底基板的空白对应区域中的与底板的空白区域重叠的部分除外的端部坯料对应区域之间的部分以相等的间隔形成通孔。
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3.发明授权Underlay substrate, screen printing method and manufacturing method of printed circuit substrate 有权衬底基板，丝网印刷法及印刷电路基板的制造方法公开(公告)号：US07851013B2
公开(公告)日：2010-12-14
申请号：US12043412
申请日：2008-03-06
Applicant: Takahiko Yokai
Inventor： Takahiko Yokai
CPC classification number: H05K3/1216 , H05K3/0052 , H05K3/0097 , H05K2203/0165 , H05K2203/082 , Y10T29/49155 , Y10T428/24273
Abstract: A plurality of through holes having an equal size are formed in an underlay substrate. Positions of the plurality of through holes are suitably set according to the shape of a substrate sheet. Specifically, an equal number of through holes are formed in each of end blank corresponding regions that, when the substrate sheet and the underlay substrate are overlapped with each other, overlap with end blank regions of the substrate sheet, of the underlay substrate. In addition, the through holes are formed at equal spacing in portions excluding the end blank corresponding regions in a blank corresponding region, which overlaps with a blank region of the substrate sheet, of the underlay substrate.
Abstract translation: 具有相同尺寸的多个通孔形成在底层基板中。 多个贯通孔的位置根据基板的形状适当设定。 具体而言，在底板对应区域中，当底板和底层基板彼此重叠时，与衬底基板的基板的端部空白区域重叠，形成相同数量的通孔。 此外，在底衬底基板的空白对应区域中的与底板的空白区域重叠的部分除外的端部坯料对应区域之间的部分以相等的间隔形成通孔。
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4.发明申请公开(公告)号：US20080217045A1
公开(公告)日：2008-09-11
申请号：US12043412
申请日：2008-03-06
Applicant: Takahiko YOKAI
Inventor： Takahiko YOKAI
CPC classification number: H05K3/1216 , H05K3/0052 , H05K3/0097 , H05K2203/0165 , H05K2203/082 , Y10T29/49155 , Y10T428/24273
Abstract: A plurality of through holes having an equal size are formed in an underlay substrate. Positions of the plurality of through holes are suitably set according to the shape of a substrate sheet. Specifically, an equal number of through holes are formed in each of end blank corresponding regions that, when the substrate sheet and the underlay substrate are overlapped with each other, overlap with end blank regions of the substrate sheet, of the underlay substrate. In addition, the through holes are formed at equal spacing in portions excluding the end blank corresponding regions in a blank corresponding region, which overlaps with a blank region of the substrate sheet, of the underlay substrate.
Abstract translation: 具有相同尺寸的多个通孔形成在底层基板中。 多个贯通孔的位置根据基板的形状适当设定。 具体而言，在底板对应区域中，当底板和底层基板彼此重叠时，与衬底基板的基板的端部空白区域重叠，形成相同数量的通孔。 此外，在底衬底基板的空白对应区域中的与底板的空白区域重叠的部分除外的端部坯料对应区域之间的部分以相等的间隔形成通孔。
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5.发明授权Wired circuit board with interposed metal thin film and producing method thereof 有权带金属薄膜的有线电路板及其制造方法公开(公告)号：US08030576B2
公开(公告)日：2011-10-04
申请号：US12073193
申请日：2008-03-03
Applicant: Katsutoshi Kamei , Takahiko Yokai , Visit Thaveeprungsriporn
Inventor： Katsutoshi Kamei , Takahiko Yokai , Visit Thaveeprungsriporn
CPC classification number: H05K3/243 , H05K1/056 , H05K3/244 , H05K3/28 , H05K3/384 , H05K2201/09472 , H05K2203/0361 , H05K2203/0577
Abstract: A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer and including a wire and a terminal portion, an insulating cover layer formed on the insulating base layer and having an opening portion to expose the terminal portion, and a metal thin film including a protecting portion interposed between the wire and the insulating cover layer, and an exposed portion formed continuously from the protecting portion on a peripheral end portion of the terminal portion exposed from the opening portion.
Abstract translation: 布线电路板包括绝缘基底层，形成在绝缘基底层上并包括导线和端子部分的导电图案，形成在绝缘基底层上并具有露出端子部分的开口部分的绝缘覆盖层，以及 金属薄膜，其包括插入在所述导线和所述绝缘覆盖层之间的保护部，以及从所述开口部暴露的所述端子部的周缘部从所述保护部连续形成的露出部。
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Patent Agency Ranking
6.发明授权公开(公告)号：US07872200B2
公开(公告)日：2011-01-18
申请号：US11717706
申请日：2007-03-14
Applicant: Takahiko Yokai , Toshiki Naito , Yasunari Ooyabu
Inventor： Takahiko Yokai , Toshiki Naito , Yasunari Ooyabu
IPC: H05K1/00
CPC classification number: H01R12/592 , H01R12/52 , H05K1/056 , H05K1/118 , H05K3/363 , H05K2201/10477 , H05K2203/041
Abstract: A wired circuit board includes a metal supporting layer, an insulating layer formed on the metal supporting layer and a conductive pattern formed on the insulating layer, and having a terminal portion for connecting to an external terminal. The terminal portion is disposed at an end portion of the conductive pattern, supported on the insulating layer, and exposed from the metal supporting layer to have an end surface thereof used as a point of contact with the external terminal.
Abstract translation: 布线电路板包括金属支撑层，形成在金属支撑层上的绝缘层和形成在绝缘层上的导电图案，并且具有用于连接到外部端子的端子部分。 端子部分设置在导电图案的端部，被支撑在绝缘层上，并从金属支撑层露出，使其端面用作与外部端子的接触点。
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公开(公告)号：US20090014410A1
公开(公告)日：2009-01-15
申请号：US12216589
申请日：2008-07-08
Applicant: Takahiko Yokai , Yasunari Ooyabu , Toshiki Naito
Inventor： Takahiko Yokai , Yasunari Ooyabu , Toshiki Naito
IPC: H01B13/34
CPC classification number: G11B5/484 , G11B5/4853 , G11B5/486 , H05K1/0269 , H05K3/0008 , H05K3/0082 , H05K3/064 , H05K3/108 , H05K3/44 , H05K2201/09063 , H05K2201/0969 , H05K2201/09781 , H05K2201/09918 , H05K2203/0323 , H05K2203/056
Abstract: A producing method of a suspension board with circuit includes simultaneously forming a conductive pattern formed on an insulating layer formed on a metal supporting board and having a terminal portion for connecting to an electronic component, and a mark formed on the metal supporting board, or on the insulating layer and having an opening for forming a reference hole for mounting the electronic component, and forming the reference hole by etching the metal supporting board disposed in the opening of the mark, or the insulating layer and the metal supporting board each disposed in the opening of the mark.
Abstract translation: 具有电路的悬挂板的制造方法包括同时形成形成在金属支撑板上的绝缘层上的导电图案，并且具有用于连接到电子部件的端子部分，以及形成在金属支撑板上的标记， 所述绝缘层具有用于形成用于安装所述电子部件的基准孔的开口，并且通过蚀刻设置在所述标记的开口中的所述金属支撑板，或者设置在所述绝缘层和所述金属支撑板上而形成所述基准孔 打开标记。
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公开(公告)号：US20090008137A1
公开(公告)日：2009-01-08
申请号：US12216511
申请日：2008-07-07
Applicant: Takahiko Yokai , Toshiki Naito
Inventor： Takahiko Yokai , Toshiki Naito
CPC classification number: H05K1/05 , H05K1/056 , H05K3/44 , H05K2201/09745 , H05K2201/10416 , H05K2203/0323 , H05K2203/0369 , H05K2203/0723 , Y10T29/49124
Abstract: A wired circuit board includes a metal supporting board having a depressed portion, a conductive portion embedded in the depressed portion and formed of a material having a higher conductivity than that of the metal supporting board, an insulating layer formed on the metal supporting board so as to cover the conductive portion, and a plurality of wired formed on the insulating layer in mutually spaced-apart relation so as to oppose to the conductive portion.
Abstract translation: 布线电路板包括具有凹陷部分的金属支撑板，嵌入在凹陷部分中的导电部分，并且由具有比金属支撑板导电性高的材料形成的导电部分形成在金属支撑板上的绝缘层， 覆盖导电部分，并且以互相间隔的关系形成在绝缘层上以与导电部分相对的多个布线。
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公开(公告)号：US20080217383A1
公开(公告)日：2008-09-11
申请号：US12043460
申请日：2008-03-06
Applicant: Takahiko YOKAI
Inventor： Takahiko YOKAI
IPC: B23K31/02
CPC classification number: H05K3/1225 , H05K3/3484
Abstract: A screen plate having a plurality of openings is placed on a suspension substrate in which a plurality of conductive pads are formed. Conductive paste is moved in one direction on an upper surface of the screen plate, so that the conductive paste is applied onto the conductive pads through the openings. A recess that is inwardly bent is formed in each of the openings of the screen plate.
Abstract translation: 具有多个开口的筛板被放置在其上形成有多个导电垫的悬置基板上。 导电浆料在筛板的上表面上沿一个方向移动，使得导电浆料通过开口施加到导电垫片上。 在筛板的每个开口中形成向内弯曲的凹部。
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公开(公告)号：US08647517B2
公开(公告)日：2014-02-11
申请号：US12216589
申请日：2008-07-08
Applicant: Takahiko Yokai , Yasunari Ooyabu , Toshiki Naito
Inventor： Takahiko Yokai , Yasunari Ooyabu , Toshiki Naito
CPC classification number: G11B5/484 , G11B5/4853 , G11B5/486 , H05K1/0269 , H05K3/0008 , H05K3/0082 , H05K3/064 , H05K3/108 , H05K3/44 , H05K2201/09063 , H05K2201/0969 , H05K2201/09781 , H05K2201/09918 , H05K2203/0323 , H05K2203/056
Abstract: A producing method of a suspension board with circuit includes simultaneously forming a conductive pattern formed on an insulating layer formed on a metal supporting board and having a terminal portion for connecting to an electronic component, and a mark formed on the metal supporting board, or on the insulating layer and having an opening for forming a reference hole for mounting the electronic component, and forming the reference hole by etching the metal supporting board disposed in the opening of the mark, or the insulating layer and the metal supporting board each disposed in the opening of the mark.
Abstract translation: 具有电路的悬挂板的制造方法包括同时形成形成在金属支撑板上的绝缘层上的导电图案，并且具有用于连接到电子部件的端子部分，以及形成在金属支撑板上的标记， 所述绝缘层具有用于形成用于安装所述电子部件的基准孔的开口，并且通过蚀刻设置在所述标记的开口中的所述金属支撑板，或者设置在所述绝缘层和所述金属支撑板上而形成所述基准孔 打开标记。
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