Invention Grant
- Patent Title: Embedded stressor for semiconductor structures
- Patent Title (中): 半导体结构的嵌入式应力器
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Application No.: US13529558Application Date: 2012-06-21
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Publication No.: US08354720B2Publication Date: 2013-01-15
- Inventor: Dechao Guo , Shu-Jen Han , Pranita Kulkarni , Philip J. Oldiges
- Applicant: Dechao Guo , Shu-Jen Han , Pranita Kulkarni , Philip J. Oldiges
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: H01L27/12
- IPC: H01L27/12

Abstract:
A semiconductor structure includes a semiconductor substrate; a gate stack on the semiconductor substrate; a plurality of spacers disposed on laterally opposing sides of the gate stack; source and drain regions proximate to the spacers, and a channel region subjacent to the gate stack and disposed between the source and drain regions; and a stressor subjacent to the channel region, and embedded within the semiconductor substrate, the embedded stressor being formed of a triangular-shape.
Public/Granted literature
- US20120261728A1 EMBEDDED STRESSOR FOR SEMICONDUCTOR STRUCTURES Public/Granted day:2012-10-18
Information query
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