发明授权
- 专利标题： Polishing apparatus
- 专利标题（中）： 抛光设备
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申请号： US12747225申请日： 2009-02-09
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公开(公告)号： US08357029B2公开(公告)日： 2013-01-22
- 发明人: Makoto Fukushima , Tetsuji Togawa , Hozumi Yasuda , Koji Saito , Osamu Nabeya , Tomoshi Inoue
- 申请人： Makoto Fukushima , Tetsuji Togawa , Hozumi Yasuda , Koji Saito , Osamu Nabeya , Tomoshi Inoue
- 申请人地址： JP Tokyo
- 专利权人： Ebara Corporation
- 当前专利权人： Ebara Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP2008-031307 20080213
- 国际申请： PCT/JP2009/052456 WO 20090209
- 国际公布： WO2009/102047 WO 20090820
- 主分类号： B24B5/00
- IPC分类号： B24B5/00
摘要：
A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table (100) having a polishing surface (101a), a top ring body (2) configured to hold and press a substrate against the polishing surface (101a), and a retainer ring (3) provided at an outer peripheral portion of the top ring body (2) and configured to press the polishing surface (101a). A fulcrum for receiving a lateral force applied from the substrate to the retainer ring (3) during polishing of the substrate is located above a central portion of the substrate.
公开/授权文献
- US20100273405A1 POLISHING APPARATUS 公开/授权日：2010-10-28
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