Invention Grant
- Patent Title: Methods of removing water from semiconductor substrates and methods of depositing atomic layers using the same
- Patent Title (中): 从半导体衬底去除水的方法和使用其沉积原子层的方法
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Application No.: US12688044Application Date: 2010-01-15
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Publication No.: US08357593B2Publication Date: 2013-01-22
- Inventor: Ki-chul Kim , Youn-soo Kim , Ki-vin Im , Cha-young Yoo , Jong-cheol Lee , Ki-yeon Park , Hoon-sang Choi , Se-hoon Oh
- Applicant: Ki-chul Kim , Youn-soo Kim , Ki-vin Im , Cha-young Yoo , Jong-cheol Lee , Ki-yeon Park , Hoon-sang Choi , Se-hoon Oh
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, PA
- Priority: KR10-2009-0006985 20090129
- Main IPC: H01L21/322
- IPC: H01L21/322
Abstract:
Provided are methods of removing water adsorbed or bonded to a surface of a semiconductor substrate, and methods of depositing an atomic layer using the method of removing water described herein. The method of removing water includes applying a chemical solvent to the surface of a semiconductor substrate, and removing the chemical solvent from the surface of the semiconductor substrate.
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