A method of forming a pattern and a method of producing an electronic element with which a fine and precise pattern is stably formed are provided. Each of the method of forming a pattern and the method of producing an electronic element includes a step of forming an electrically conductive film D by applying a liquid composition onto a first plate 10; a step of forming an electrically conductive pattern D′ on the first plate 10 by pressing a second plate 20 onto a surface side of the first plate 10, on which the electrically conductive film D is formed, to transfer an unwanted pattern of the electrically conductive film D to top faces of projections 20a of the second plate 20, thereby removing the unwanted pattern; and a step of transferring the electrically conductive pattern D′ by pressing the surface side of the first plate 10, on which the electrically conductive pattern D′ is formed, onto a surface of a transfer-receiving substrate, wherein when a surface tension of the surface of the first plate 10, onto which the liquid composition is applied, is represented by α, a dynamic surface tension of the liquid composition at 100 msec measured by a maximum bubble pressure method is represented by β, and a surface tension of the top faces of the projections 20a of the second plate 20 is represented by γ, the composition of the liquid composition or a material of the surface of the first plate 10 or the second plate 20 is set so as to satisfy γ>α≧β.