公开(公告)号：US08941151B2

公开(公告)日：2015-01-27

申请号：US13614385

申请日：2012-09-13

申请人： Akihiro Nomoto

发明人： Akihiro Nomoto

IPC分类号： G03F7/00 ,  B82Y10/00 ,  H01L51/00 ,  H05K3/12 ,  B82Y30/00 ,  H05K1/03 ,  H01L51/05

CPC分类号： H01L51/0004 ,  B82Y10/00 ,  B82Y30/00 ,  H01L51/0541 ,  H01L51/0545 ,  H05K1/0393 ,  H05K3/1241 ,  H05K2203/0126 ,  H05K2203/1581 ,  Y10T29/49124

摘要： In the condition where a nozzle for applying a coating liquid is disposed on the lower side of a substrate and a substrate surface controlled in wettability is faced down, the nozzle and the substrate are moved relative to each other, whereby the coating liquid is applied to a desired region of the substrate, and then the coating liquid is dried, to obtain a pattern included a dried coating layer.

摘要翻译： 在将基板的下侧配置涂布用喷嘴的喷嘴和润湿性控制的基板面朝下的状态下，使喷嘴和基板相对移动，由此将涂布液涂布于 基材的期望区域，然后将涂布液干燥，得到包含干燥涂层的图案。

公开(公告)号：US20110024179A1

公开(公告)日：2011-02-03

申请号：US12836058

申请日：2010-07-14

申请人： Akihiro Nomoto

发明人： Akihiro Nomoto

IPC分类号： H05K1/11 ,  H01L21/329

CPC分类号： H05K1/16 ,  H05K3/1275 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/10174 ,  H05K2203/1476

摘要： A method for producing a circuit board, the method includes the steps of: forming a lower wiring pattern on a substrate; forming an insulating film on the substrate to cover the lower wiring pattern; forming an opening in the insulating film to expose the lower wiring pattern; forming an upper wiring pattern on the insulating film; and forming an interconnect material pattern on a sidewall of the opening in the insulating film for connecting the lower wiring pattern and the upper wiring pattern.

摘要翻译： 一种电路板的制造方法，该方法包括以下步骤：在基板上形成下布线图案; 在基板上形成绝缘膜以覆盖下布线图案; 在绝缘膜上形成开口以露出下布线图案; 在绝缘膜上形成上部布线图案; 以及在所述绝缘膜中的所述开口的侧壁上形成互连材料图案，以连接所述下布线图案和所述上布线图案。

公开(公告)号：US20100044905A1

公开(公告)日：2010-02-25

申请号：US12593846

申请日：2008-01-10

申请人： Toshio Fukuda ,  Akihiro Nomoto

发明人： Toshio Fukuda ,  Akihiro Nomoto

IPC分类号： B28B3/00

CPC分类号： H05K3/207 ,  H01L51/0022 ,  H01L51/0541 ,  H01L51/0545 ,  H01L51/102 ,  H05K3/046 ,  H05K2203/0108

摘要： A method of forming a pattern and a method of producing an electronic element with which a fine and precise pattern is stably formed are provided. Each of the method of forming a pattern and the method of producing an electronic element includes a step of forming an electrically conductive film D by applying a liquid composition onto a first plate 10; a step of forming an electrically conductive pattern D′ on the first plate 10 by pressing a second plate 20 onto a surface side of the first plate 10, on which the electrically conductive film D is formed, to transfer an unwanted pattern of the electrically conductive film D to top faces of projections 20a of the second plate 20, thereby removing the unwanted pattern; and a step of transferring the electrically conductive pattern D′ by pressing the surface side of the first plate 10, on which the electrically conductive pattern D′ is formed, onto a surface of a transfer-receiving substrate, wherein when a surface tension of the surface of the first plate 10, onto which the liquid composition is applied, is represented by α, a dynamic surface tension of the liquid composition at 100 msec measured by a maximum bubble pressure method is represented by β, and a surface tension of the top faces of the projections 20a of the second plate 20 is represented by γ, the composition of the liquid composition or a material of the surface of the first plate 10 or the second plate 20 is set so as to satisfy γ>α≧β.

摘要翻译： 提供一种形成图案的方法和制造精细且精确图案稳定地形成的电子元件的方法。 形成图案的方法和电子元件的制造方法中的每一个包括通过将液体组合物涂布在第一板10上而形成导电膜D的步骤; 通过将第二板20压在其上形成有导电膜D的第一板10的表面侧上以在第一板10上形成导电图案D'以转移不需要的导电图案的步骤 膜D到第二板20的突起20a的顶面，从而去除不想要的图案; 以及通过将形成有导电图案D'的第一板10的表面侧按压在转印接收基板的表面上来转印导电图案D'的步骤，其中当转印接收基板的表面张力 其上施加液体组合物的第一板10的表面由α表示，用最大气泡压力法测量的100毫秒时液体组合物的动态表面张力由＆bgr表示，表面张力 第二板20的突起20a的顶面由γ表示，液体组成的组成或第一板10或第二板20的表面的材料的设定为满足γ>α≥bgr; 。

公开(公告)号：US20080152789A1

公开(公告)日：2008-06-26

申请号：US12072171

申请日：2008-02-25

申请人： Akihiro Nomoto

发明人： Akihiro Nomoto

IPC分类号： B05D5/12

CPC分类号： H01L51/0004 ,  B82Y10/00 ,  B82Y30/00 ,  H01L51/0541 ,  H01L51/0545 ,  H05K1/0393 ,  H05K3/1241 ,  H05K2203/0126 ,  H05K2203/1581 ,  Y10T29/49124

摘要： In the condition where a nozzle for applying a coating liquid is disposed on the lower side of a substrate and a substrate surface controlled in wettability is faced down, the nozzle and the substrate are moved relative to each other, whereby the coating liquid is applied to a desired region of the substrate, and then the coating liquid is dried, to obtain a pattern included a dried coating layer.

公开(公告)号：US08361372B2

公开(公告)日：2013-01-29

申请号：US12593846

申请日：2008-01-10

申请人： Toshio Fukuda ,  Akihiro Nomoto

发明人： Toshio Fukuda ,  Akihiro Nomoto

IPC分类号： B29C41/46

CPC分类号： H05K3/207 ,  H01L51/0022 ,  H01L51/0541 ,  H01L51/0545 ,  H01L51/102 ,  H05K3/046 ,  H05K2203/0108

摘要： A method of forming a pattern and a method of producing an electronic element with which a fine and precise pattern is stably formed are provided. Each of the method of forming a pattern and the method of producing an electronic element includes a step of forming an electrically conductive film D by applying a liquid composition onto a first plate 10; a step of forming an electrically conductive pattern D′ on the first plate 10 by pressing a second plate 20 onto a surface side of the first plate 10, on which the electrically conductive film D is formed, to transfer an unwanted pattern of the electrically conductive film D to top faces of projections 20a of the second plate 20, thereby removing the unwanted pattern; and a step of transferring the electrically conductive pattern D′ by pressing the surface side of the first plate 10, on which the electrically conductive pattern D′ is formed, onto a surface of a transfer-receiving substrate, wherein when a surface tension of the surface of the first plate 10, onto which the liquid composition is applied, is represented by α, a dynamic surface tension of the liquid composition at 100 msec measured by a maximum bubble pressure method is represented by β, and a surface tension of the top faces of the projections 20a of the second plate 20 is represented by γ, the composition of the liquid composition or a material of the surface of the first plate 10 or the second plate 20 is set so as to satisfy γ>α≧β.

摘要翻译： 提供一种形成图案的方法和制造精细且精确图案稳定地形成的电子元件的方法。 形成图案的方法和电子元件的制造方法中的每一个包括通过将液体组合物涂布在第一板10上而形成导电膜D的步骤; 通过将第二板20压在其上形成有导电膜D的第一板10的表面侧上以在第一板10上形成导电图案D'以转移不需要的导电图案的步骤 膜D到第二板20的突起20a的顶面，从而去除不想要的图案; 以及通过将形成有导电图案D'的第一板10的表面侧按压在转印接收基板的表面上来转印导电图案D'的步骤，其中当转印接收基板的表面张力 其上施加液体组合物的第一板10的表面由α表示，用最大气泡压力法测量的100毫秒时液体组合物的动态表面张力由＆bgr表示，表面张力 第二板20的突起20a的顶面由γ表示，液体组成的组成或第一板10或第二板20的表面的材料的设定为满足γ>α≥bgr; 。

公开(公告)号：US08277901B2

公开(公告)日：2012-10-02

申请号：US12072234

申请日：2008-02-25

申请人： Akihiro Nomoto

发明人： Akihiro Nomoto

IPC分类号： B05D5/12

CPC分类号： H01L51/0004 ,  B82Y10/00 ,  B82Y30/00 ,  H01L51/0541 ,  H01L51/0545 ,  H05K1/0393 ,  H05K3/1241 ,  H05K2203/0126 ,  H05K2203/1581 ,  Y10T29/49124

摘要： In the condition where a nozzle for applying a coating liquid is disposed on the lower side of a substrate and a substrate surface controlled in wettability is faced down, the nozzle and the substrate are moved relative to each other, whereby the coating liquid is applied to a desired region of the substrate, and then the coating liquid is dried, to obtain a pattern included a dried coating layer.

公开(公告)号：US08277900B2

公开(公告)日：2012-10-02

申请号：US12072171

申请日：2008-02-25

申请人： Akihiro Nomoto

发明人： Akihiro Nomoto

IPC分类号： B05D5/12

CPC分类号： H01L51/0004 ,  B82Y10/00 ,  B82Y30/00 ,  H01L51/0541 ,  H01L51/0545 ,  H05K1/0393 ,  H05K3/1241 ,  H05K2203/0126 ,  H05K2203/1581 ,  Y10T29/49124

摘要： In the condition where a nozzle for applying a coating liquid is disposed on the lower side of a substrate and a substrate surface controlled in wettability is faced down, the nozzle and the substrate are moved relative to each other, whereby the coating liquid is applied to a desired region of the substrate, and then the coating liquid is dried, to obtain a pattern included a dried coating layer.

摘要翻译： 在将基板的下侧配置涂布用喷嘴的喷嘴和润湿性控制的基板面朝下的状态下，使喷嘴和基板相对移动，由此将涂布液涂布于 基材的期望区域，然后将涂布液干燥，得到包含干燥涂层的图案。

公开(公告)号：US08222096B2

公开(公告)日：2012-07-17

申请号：US12508007

申请日：2009-07-23

申请人： Akihiro Nomoto

发明人： Akihiro Nomoto

IPC分类号： H01L21/84

CPC分类号： H01L51/0004 ,  H01L27/283

摘要： A method for forming an organic semiconductor thin film includes the steps of forming a mixed ink layer on a principal plane of a printing plate, the mixed ink layer including a mixture of an organic semiconductor material incapable of transcription and an organic material capable of transcription from the printing plate to a substrate in ink form dissolved in a solvent, and forming an organic semiconductor thin film by transcribing the mixed ink layer onto the substrate by transcribing the mixed ink layer on the printing plate to the substrate.

摘要翻译： 一种形成有机半导体薄膜的方法包括以下步骤：在印版的主平面上形成混合墨层，所述混合墨层包括不能转录的有机半导体材料和能够转印的有机半导体材料的混合物 将印版印刷成溶解在溶剂中的油墨形式的基材，通过将印刷板上的混合油墨层转印到基材上，将混合油墨层转印到基材上形成有机半导体薄膜。

公开(公告)号：US20110081746A1

公开(公告)日：2011-04-07

申请号：US12888488

申请日：2010-09-23

申请人： Akihiro Nomoto ,  Hideki Ono

发明人： Akihiro Nomoto ,  Hideki Ono

IPC分类号： H01L51/40

CPC分类号： H01L51/0015 ,  H01L51/0011 ,  H01L51/0545 ,  H01L51/0558

摘要： A method for producing a semiconductor device includes the steps of forming an organic semiconductor layer on a substrate; forming a protective pattern on the organic semiconductor layer; and patterning the organic semiconductor layer by dissolving, in an organic solvent, or subliming the organic semiconductor layer using the protective pattern as a mask.

摘要翻译： 一种制造半导体器件的方法包括以下步骤：在衬底上形成有机半导体层; 在有机半导体层上形成保护图案; 并通过在有机溶剂中溶解或使用保护图案作为掩模使有机半导体层升华来图案化有机半导体层。

公开(公告)号：US20100085911A1

公开(公告)日：2010-04-08

申请号：US12294856

申请日：2007-03-28

申请人： Akihiro Nomoto

发明人： Akihiro Nomoto

IPC分类号： H04W40/00

CPC分类号： H04B10/25754 ,  H04B1/18 ,  H04W88/08

摘要： A base station device of the present invention includes a base-station main body and multiple antenna units connected in series to the base-station main body. Each of the antenna units includes: a wireless communication unit that includes an antenna for wirelessly transmitting and receiving a signal to and from a mobile terminal; a multiplexer that multiplexes a reception signal received by another antenna unit and a reception signal received by the wireless communication unit, and outputs the multiplexed reception signals to the base-station main body; and a demultiplexer that separates a transmission signal to be transmitted by the wireless communication unit from among multiplexed transmission signals input from the base-station main body, and outputs a transmission signal to be transmitted from the other antenna unit thereto. The base-station main body includes: a demultiplexer that demultiplexes the multiplexed reception signals into reception signals received by wireless communication units of the antenna units; and a multiplexer that multiplexes transmission signals output from the network and to be transmitted from the antenna units and outputs the multiplexed transmission signals to the antenna units.

摘要翻译： 本发明的基站装置包括基站主体和与基站主体串联连接的多个天线单元。 每个天线单元包括：无线通信单元，其包括用于向移动终端进行无线发送和接收信号的天线; 复用多路复用由另一天线单元接收的接收信号和由无线通信单元接收的接收信号，并将多路复用的接收信号输出到基站主体; 以及解复用器，其将从无线通信单元发送的发送信号与从基站主体输入的多路复用的发送信号中分离，并且从另一天线单元输出要发送的发送信号。 基站主体包括：解复用器，将多路复用的接收信号解复用为由天线单元的无线通信单元接收的接收信号; 以及复用器，其多路复用从网络输出并从天线单元发送的发送信号，并将多路复用的发送信号输出到天线单元。