发明授权
- 专利标题： Drop-mold conformable material as an encapsulation for an integrated circuit package system and method for manufacturing thereof
- 专利标题（中）： 作为用于集成电路封装系统的封装的脱模合格材料及其制造方法
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申请号： US12912728申请日： 2010-10-26
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公开(公告)号： US08368188B2公开(公告)日： 2013-02-05
- 发明人: Byung Tai Do , Heap Hoe Kuan , Rui Huang
- 申请人： Byung Tai Do , Heap Hoe Kuan , Rui Huang
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 代理商 Miko Ishimaru
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A method for manufacturing an integrated circuit package system includes: providing an integrated circuit; mounting a lead on the periphery of the integrated circuit; connecting the integrated circuit to the lead with an interconnect; and forming a conformable material by pressing the conformable material on the integrated circuit, the lead, and the interconnect.
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