Invention Grant
- Patent Title: Heat radiation package and semiconductor device
- Patent Title (中): 散热封装和半导体器件
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Application No.: US12187641Application Date: 2008-08-07
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Publication No.: US08368206B2Publication Date: 2013-02-05
- Inventor: Akinori Shiraishi , Kei Murayama , Yuichi Taguchi , Masahiro Sunohara , Mitsutoshi Higashi
- Applicant: Akinori Shiraishi , Kei Murayama , Yuichi Taguchi , Masahiro Sunohara , Mitsutoshi Higashi
- Applicant Address: JP Nagano-shi
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2007-208883 20070810
- Main IPC: H01L33/64
- IPC: H01L33/64
Abstract:
A heat radiation package of the present invention includes a substrate in an upper surface side of which recess portion is provided, embedded wiring portion which is filled in the recess portion of the substrate and on which semiconductor element which generates a heat is mounted, and a heat sink connected to a lower surface side of the substrate. The substrate is made of silicon, ceramics, or insulating resin.
Public/Granted literature
- US20090039379A1 HEAT RADIATION PACKAGE AND SEMICONDUCTOR DEVICE Public/Granted day:2009-02-12
Information query
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