发明授权
- 专利标题： Heat radiation package and semiconductor device
- 专利标题（中）： 散热封装和半导体器件
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申请号： US12187641申请日： 2008-08-07
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公开(公告)号： US08368206B2公开(公告)日： 2013-02-05
- 发明人: Akinori Shiraishi , Kei Murayama , Yuichi Taguchi , Masahiro Sunohara , Mitsutoshi Higashi
- 申请人： Akinori Shiraishi , Kei Murayama , Yuichi Taguchi , Masahiro Sunohara , Mitsutoshi Higashi
- 申请人地址： JP Nagano-shi
- 专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人地址： JP Nagano-shi
- 代理机构： Kratz, Quintos & Hanson, LLP
- 优先权： JP2007-208883 20070810
- 主分类号： H01L33/64
- IPC分类号： H01L33/64
摘要：
A heat radiation package of the present invention includes a substrate in an upper surface side of which recess portion is provided, embedded wiring portion which is filled in the recess portion of the substrate and on which semiconductor element which generates a heat is mounted, and a heat sink connected to a lower surface side of the substrate. The substrate is made of silicon, ceramics, or insulating resin.
公开/授权文献
- US20090039379A1 HEAT RADIATION PACKAGE AND SEMICONDUCTOR DEVICE 公开/授权日：2009-02-12
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