发明授权
- 专利标题： LED package for uniform color emission
- 专利标题（中）： LED封装，均匀发光
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申请号： US13031629申请日： 2011-02-22
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公开(公告)号： US08373183B2公开(公告)日： 2013-02-12
- 发明人: Shan Mei Wan , Chang Shu Lee , Ming Lu
- 申请人： Shan Mei Wan , Chang Shu Lee , Ming Lu
- 申请人地址： HK New Territories
- 专利权人： Hong Kong Applied Science and Technology Research Institute Company Limited
- 当前专利权人： Hong Kong Applied Science and Technology Research Institute Company Limited
- 当前专利权人地址： HK New Territories
- 代理机构： Ella Cheong Hong Kong
- 代理商 Sam T. Yip
- 主分类号： H01L33/48
- IPC分类号： H01L33/48 ; H01L33/50 ; H01L33/00 ; F21S2/00
摘要：
A light emitting diode package for one or more light emitting diodes mounted on a substrate. A frame is disposed on at least a portion of the substrate and substantially surrounds, but does not contact, the light emitting diode. The frame is substantially transparent to light emitted from the light emitting diode and includes one or more first wavelength converting materials. The wavelength converting materials, which may be one or more phosphors, convert at least a portion of light emitted at the emission wavelength to different wavelength. A cover covers the light emitting diode within the frame. The cover layer includes one or more second wavelength converting materials differing from the first one or more wavelength converting materials in wavelength converting material concentration or in converted light wavelength or in combinations of wavelength converting materials.
公开/授权文献
- US20120211778A1 LED PACKAGE FOR UNIFORM COLOR EMISSION 公开/授权日：2012-08-23
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