公开(公告)号：US5893731A

公开(公告)日：1999-04-13

申请号：US862796

申请日：1997-05-23

申请人： Chang-Shu Lee ,  Tsung-Yao Chu

发明人： Chang-Shu Lee ,  Tsung-Yao Chu

IPC分类号： H01L21/02 ,  H01L27/06 ,  H01L21/8234

CPC分类号： H01L28/20 ,  H01L27/0688 ,  H01L28/40

摘要： A low cost method for forming an integrated resistor capacitor combination using only three masks and three mask exposure steps is described. A layer of resistor material is formed on a substrate and patterned forming a resistor and a first capacitor plate. A photoresist mask is then formed covering the resistor and a contact region of the first capacitor plate. The substrate is then immersed in an anodization solution and that part of the first capacitor plate not covered by the photoresist mask is anodized forming a capacitor dielectric. The photoresist mask is then stripped. A layer of conductor material is then formed and patterned to form contacts to the resistor, a contact to the first capacitor plate, and a second capacitor plate.

摘要翻译： 描述了仅使用三个掩模和三个掩模曝光步骤形成集成电阻器电容器组合的低成本方法。 在基板上形成电阻材料层，并形成电阻器和第一电容器板。 然后形成覆盖电阻器和第一电容器板的接触区域的光致抗蚀剂掩模。 然后将衬底浸入阳极氧化溶液中，并且未被光致抗蚀剂掩模覆盖的部分第一电容器板被阳极氧化形成电容器电介质。 然后剥离光致抗蚀剂掩模。 然后形成导体材料层并构图以形成与电阻器的接触，与第一电容器板的接触以及第二电容器板。

公开(公告)号：US08373183B2

公开(公告)日：2013-02-12

申请号：US13031629

申请日：2011-02-22

申请人： Shan Mei Wan ,  Chang Shu Lee ,  Ming Lu

发明人： Shan Mei Wan ,  Chang Shu Lee ,  Ming Lu

IPC分类号： H01L33/48 ,  H01L33/50 ,  H01L33/00 ,  F21S2/00

CPC分类号： H01L33/504 ,  H01L33/505 ,  H01L51/5036 ,  H01L51/524 ,  H01L51/5253 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting diode package for one or more light emitting diodes mounted on a substrate. A frame is disposed on at least a portion of the substrate and substantially surrounds, but does not contact, the light emitting diode. The frame is substantially transparent to light emitted from the light emitting diode and includes one or more first wavelength converting materials. The wavelength converting materials, which may be one or more phosphors, convert at least a portion of light emitted at the emission wavelength to different wavelength. A cover covers the light emitting diode within the frame. The cover layer includes one or more second wavelength converting materials differing from the first one or more wavelength converting materials in wavelength converting material concentration or in converted light wavelength or in combinations of wavelength converting materials.

摘要翻译： 一种用于安装在基板上的一个或多个发光二极管的发光二极管封装。 框架设置在基板的至少一部分上并基本上包围但不接触发光二极管。 该框架对于从发光二极管发出的光基本上是透明的，并且包括一个或多个第一波长转换材料。 可以是一种或多种荧光体的波长转换材料将在发射波长处发射的光的至少一部分转换成不同的波长。 盖子覆盖框架内的发光二极管。 覆盖层包括与波长转换材料浓度或转换光波长中的第一或多个波长转换材料不同的一个或多个第二波长转换材料或波长转换材料的组合。

公开(公告)号：US20120211778A1

公开(公告)日：2012-08-23

申请号：US13031629

申请日：2011-02-22

申请人： Shan Mei WAN ,  Chang Shu LEE ,  Ming LU

发明人： Shan Mei WAN ,  Chang Shu LEE ,  Ming LU

IPC分类号： H01L33/48 ,  H01L33/50

CPC分类号： H01L33/504 ,  H01L33/505 ,  H01L51/5036 ,  H01L51/524 ,  H01L51/5253 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting diode package for one or more light emitting diodes mounted on a substrate. A frame is disposed on at least a portion of the substrate and substantially surrounds, but does not contact, the light emitting diode. The frame is substantially transparent to light emitted from the light emitting diode and includes one or more first wavelength converting materials. The wavelength converting materials, which may be one or more phosphors, convert at least a portion of light emitted at the emission wavelength to different wavelength. A cover covers the light emitting diode within the frame. The cover layer includes one or more second wavelength converting materials differing from the first one or more wavelength converting materials in wavelength converting material concentration or in converted light wavelength or in combinations of wavelength converting materials.

摘要翻译： 一种用于安装在基板上的一个或多个发光二极管的发光二极管封装。 框架设置在基板的至少一部分上并基本上包围但不接触发光二极管。 该框架对于从发光二极管发出的光基本上是透明的，并且包括一个或多个第一波长转换材料。 可以是一种或多种荧光体的波长转换材料将在发射波长处发射的光的至少一部分转换成不同的波长。 盖子覆盖框架内的发光二极管。 覆盖层包括与波长转换材料浓度或转换光波长中的第一或多个波长转换材料不同的一个或多个第二波长转换材料或波长转换材料的组合。