Invention Grant
- Patent Title: Method for fabrication of a semiconductor device and structure
- Patent Title (中): 半导体器件和结构的制造方法
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Application No.: US12904114Application Date: 2010-10-13
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Publication No.: US08373230B1Publication Date: 2013-02-12
- Inventor: Zvi Or-Bach , Brian Cronquist , Isreal Beinglass , Jan Lodewijk de Jong , Deepak C. Sekar
- Applicant: Zvi Or-Bach , Brian Cronquist , Isreal Beinglass , Jan Lodewijk de Jong , Deepak C. Sekar
- Applicant Address: US CA San Jose
- Assignee: Monolithic 3D Inc.
- Current Assignee: Monolithic 3D Inc.
- Current Assignee Address: US CA San Jose
- Agency: Tran & Associates
- Main IPC: H01L27/12
- IPC: H01L27/12
Abstract:
Systems and methods are disclosed for fabricating a semiconductor device, includes implanting one or more regions on a semiconductor wafer; performing a layer transfer onto a carrier; and transferring from said carrier to a target wafer.
Information query
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