Invention Grant
- Patent Title: 3D semiconductor device
- Patent Title (中): 3D半导体器件
-
Application No.: US12941075Application Date: 2010-11-07
-
Publication No.: US08373439B2Publication Date: 2013-02-12
- Inventor: Zvi Or-Bach
- Applicant: Zvi Or-Bach
- Applicant Address: US CA San Jose
- Assignee: Monolithic 3D Inc.
- Current Assignee: Monolithic 3D Inc.
- Current Assignee Address: US CA San Jose
- Agency: Tran & Associates
- Main IPC: H03K19/173
- IPC: H03K19/173
Abstract:
A wafer includes a group of tiles of programmable logic formed thereon, wherein each tile comprises a micro control unit (MCU) communicating with adjacent MCUs, and wherein each MCU is controlled in a predetermined order of priority by adjacent MCUs; and dice lines on the wafer to separate the group into one or more end-devices.
Public/Granted literature
- US20120193681A1 3D SEMICONDUCTOR DEVICE Public/Granted day:2012-08-02
Information query
IPC分类:
