发明授权
- 专利标题: Increased sensor die adhesion
- 专利标题(中): 增加传感器模具附着力
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申请号: US12965469申请日: 2010-12-10
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公开(公告)号: US08375799B2公开(公告)日: 2013-02-19
- 发明人: Alistair David Bradley , Lamar Floyd Ricks , Richard Alan Davis
- 申请人: Alistair David Bradley , Lamar Floyd Ricks , Richard Alan Davis
- 申请人地址: US NJ Morristown
- 专利权人: Honeywell International Inc.
- 当前专利权人: Honeywell International Inc.
- 当前专利权人地址: US NJ Morristown
- 代理机构: Seager Tufte & Wickhem LLC
- 主分类号: G01L9/06
- IPC分类号: G01L9/06
摘要:
Methods and devices for adhesively bonding a sensor die to a substrate are described. In some cases, a sensor assembly may include a pressure sensor die mounted to a substrate with an adhesive. The pressure sensor die may be fabricated to include a back-side having one or more adhesion features (e.g. recesses or indentations), which increase the surface area of the pressure sensor die that is in contact with the adhesive, to thereby increase the adhesion force therebetween. In some cases, the one or more adhesion features may define a non-planar interface between the pressure sensor die and the adhesive which, in some instances, may reduce the formation and/or propagation of cracks in the adhesive, which also may help increase the adhesion force therebetween.
公开/授权文献
- US20120144921A1 INCREASED SENSOR DIE ADHESION 公开/授权日:2012-06-14