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公开(公告)号：US08375799B2
公开(公告)日：2013-02-19
申请号：US12965469
申请日：2010-12-10
IPC分类号： G01L9/06
CPC分类号： G01L19/147 , H01L2224/48091 , H01L2224/48137 , H01L2924/10253 , Y10T29/49007 , H01L2924/00014 , H01L2924/00
摘要： Methods and devices for adhesively bonding a sensor die to a substrate are described. In some cases, a sensor assembly may include a pressure sensor die mounted to a substrate with an adhesive. The pressure sensor die may be fabricated to include a back-side having one or more adhesion features (e.g. recesses or indentations), which increase the surface area of the pressure sensor die that is in contact with the adhesive, to thereby increase the adhesion force therebetween. In some cases, the one or more adhesion features may define a non-planar interface between the pressure sensor die and the adhesive which, in some instances, may reduce the formation and/or propagation of cracks in the adhesive, which also may help increase the adhesion force therebetween.
摘要翻译： 描述了用于将传感器管芯粘合到基底上的方法和装置。 在一些情况下，传感器组件可以包括用粘合剂安装到基底的压力传感器模具。 压力传感器芯片可以被制造成包括具有一个或多个粘合特征（例如凹部或凹陷）的背面，其增加与粘合剂接触的压力传感器模具的表面积，从而增加粘合力 之间。 在一些情况下，一个或多个粘合特征可以限定压力传感器管芯和粘合剂之间的非平面界面，在一些情况下，这可以减少粘合剂中裂纹的形成和/或传播，这也可能有助于增加 其间的粘合力。
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公开(公告)号：US20120144921A1
公开(公告)日：2012-06-14
申请号：US12965469
申请日：2010-12-10
CPC分类号： G01L19/147 , H01L2224/48091 , H01L2224/48137 , H01L2924/10253 , Y10T29/49007 , H01L2924/00014 , H01L2924/00
摘要： Methods and devices for adhesively bonding a sensor die to a substrate are described. In some cases, a sensor assembly may include a pressure sensor die mounted to a substrate with an adhesive. The pressure sensor die may be fabricated to include a back-side having one or more adhesion features (e.g. recesses or indentations), which increase the surface area of the pressure sensor die that is in contact with the adhesive, to thereby increase the adhesion force therebetween. In some cases, the one or more adhesion features may define a non-planar interface between the pressure sensor die and the adhesive which, in some instances, may reduce the formation and/or propagation of cracks in the adhesive, which also may help increase the adhesion force therebetween.
摘要翻译： 描述了用于将传感器管芯粘合到基底上的方法和装置。 在一些情况下，传感器组件可以包括用粘合剂安装到基底的压力传感器模具。 压力传感器芯片可以被制造成包括具有一个或多个粘合特征（例如凹部或凹陷）的背面，其增加与粘合剂接触的压力传感器模具的表面积，从而增加粘合力 之间。 在一些情况下，一个或多个粘合特征可以限定压力传感器管芯和粘合剂之间的非平面界面，在一些情况下，这可以减少粘合剂中裂纹的形成和/或传播，这也可能有助于增加 其间的粘合力。
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3.发明授权Flow sensor apparatus and method with media isolated electrical connections 有权具有介质隔离电气连接的流量传感器装置和方法公开(公告)号：US08033180B2
公开(公告)日：2011-10-11
申请号：US12779657
申请日：2010-05-13
IPC分类号： G01L7/00
CPC分类号： G01L19/0023 , G01F1/363 , G01F1/48 , Y10T29/49002 , Y10T29/49826
摘要： A flow sensor apparatus that utilizes a pressure sensor with media isolated electrical connections. A cap can be attached to topside of the pressure sensor over a diaphragm to protect bond pads and wire bonds from a fluid media. A flow channel can be etched on the cap with an opening and exit on the sides of the cap so that liquid can flow through the flow channel. An inlet port and an outlet port can be attached to the channel's opening and exit to allow for fluid flow over the diaphragm. The flow channel creates a larger pressure over portions of the diaphragm that increases the deflection of the diaphragm, which increases an output signal of the pressure sensor. V-grooves can be created on two sides of the pressure sensor and in the cap to create the channel for the fluid in and out of the cap's cavity.
摘要翻译： 一种使用具有介质隔离电气连接的压力传感器的流量传感器装置。 盖可以通过隔膜连接到压力传感器的顶部，以保护接合垫和引线接合与流体介质。 可以在盖上蚀刻流动通道，其开口和出口在盖的侧面上，使得液体可以流过流动通道。 入口和出口可以连接到通道的开口和出口，以允许流体流过隔膜。 流动通道在膜片的部分上产生较大的压力，这增加了膜片的偏转，这增加了压力传感器的输出信号。 可以在压力传感器和盖子的两侧上形成V形槽，以形成流体进出盖体腔体的通道。
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4.发明授权Method and system for adjusting characteristics of integrated relative humidity sensor 有权综合相对湿度传感器特性调整方法及系统公开(公告)号：US07924028B2
公开(公告)日：2011-04-12
申请号：US12052535
申请日：2008-03-20
申请人： Yousef Alimi , Richard Alan Davis
发明人： Yousef Alimi , Richard Alan Davis
IPC分类号： G01R27/26
CPC分类号： G01N27/121 , G01N27/225
摘要： A method and system for adjusting characteristics of a relative humidity sensor in order to achieve a desired value of accuracy is presented. A relative humidity sensor charge balance circuit includes a series of sensing capacitors Cx1, Cx2 including a thin porous platinum top plate, a humidity sensitive polyimide dielectric, and two metal bottom plates on a semiconductor substrate; and two fixed oxide capacitances Cref, and C0. Changes in humidity affect the humidity sensitive dielectric thereby causing changes in the sensing capacitive value of the capacitive circuit. The charge in the sensing capacitor and the fixed capacitor C0 can be controlled separately by adjusting and/or trimming the supply voltage using a voltage trimmer; thereby the slope and offset of the relative humidity sensor circuit can be modified and controlled to particular desired values.
摘要翻译： 提出了一种用于调整相对湿度传感器特性以达到所需精度值的方法和系统。 相对湿度传感器电荷平衡电路包括在半导体衬底上的一系列感测电容器Cx1，Cx2，包括薄多孔铂顶板，湿度敏感聚酰亚胺电介质和两个金属底板; 和两个固定的氧化物电容Cref和C0。 湿度的变化影响湿敏电介质，从而引起电容电路的感应电容值的变化。 感测电容器和固定电容器C0中的电荷可以通过使用电压调节器调节和/或调整电源电压来分开控制; 从而相对湿度传感器电路的斜率和偏移可以被修改和控制到特定的期望值。
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公开(公告)号：US20110252882A1
公开(公告)日：2011-10-20
申请号：US12762797
申请日：2010-04-19
CPC分类号： G01F1/6845 , G01F15/14 , Y10T29/49002
摘要： A robust sensor, such as a robust flow sensor or pressure sensor, is provided. In one illustrative embodiment, a robust flow sensor includes one or more flow sensor components secured relative to a membrane, and a substrate for supporting the membrane. In some cases, the one or more flow sensor components may be substantially thermally isolated from the substrate by the membrane. One or more wire bond pads may be situated adjacent to a first side of the substrate and may be provided for communicating signals relative to the one or more flow sensor components. A top cap may be situated adjacent to the first side of the substrate and secured relative to the substrate. The top cap may define at least part of a fluid inlet and/or an outlet of the flow sensor assembly, and may at least partially define a flow channel that extends from the inlet, past at least one of the one or more flow sensor components, and out the outlet of the flow sensor assembly. The top cap may be structured and attached relative to the first side of the substrate such that the one or more wire bond pads are not exposed to a fluid in the flow channel, but are accessible for electrical connection to an external device. While a flow sensor is used as an example, it is contemplated that any suitable sensor may be used, as desired.
摘要翻译： 提供鲁棒的传感器，例如鲁棒的流量传感器或压力传感器。 在一个说明性实施例中，坚固的流量传感器包括相对于膜固定的一个或多个流量传感器部件和用于支撑膜的基板。 在一些情况下，一个或多个流量传感器组件可以通过膜与衬底基本上热隔离。 一个或多个引线接合焊盘可以位于与衬底的第一侧相邻的位置，并且可被设置用于相对于一个或多个流量传感器部件传送信号。 顶盖可以位于邻近衬底的第一侧并相对于衬底固定。 顶盖可以限定流量传感器组件的流体入口和/或出口的至少一部分，并且可以至少部分地限定从入口延伸通过一个或多个流量传感器部件中的至少一个的流动通道 ，并从流量传感器组件的出口排出。 顶盖可以相对于基板的第一侧被构造和附接，使得一个或多个引线接合焊盘不暴露于流动通道中的流体，而是可访问以用于与外部设备的电连接。 虽然使用流量传感器作为示例，但是可以设想，可以根据需要使用任何合适的传感器。
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6.发明授权Flow sensor apparatus and method with media isolated electrical connections 有权具有介质隔离电气连接的流量传感器装置和方法公开(公告)号：US07765872B2
公开(公告)日：2010-08-03
申请号：US12273912
申请日：2008-11-19
IPC分类号： G01L7/00
CPC分类号： G01L19/0023 , G01F1/363 , G01F1/48 , Y10T29/49002 , Y10T29/49826
摘要： A flow sensor apparatus that utilizes a pressure sensor with media isolated electrical connections. A cap can be attached to topside of the pressure sensor over a diaphragm to protect bond pads and wire bonds from a fluid media. A flow channel can be etched on the cap with an opening and exit on the sides of the cap so that liquid can flow through the flow channel. An inlet port and an outlet port can be attached to the channel's opening and exit to allow for fluid flow over the diaphragm. The flow channel creates a larger pressure over portions of the diaphragm that increases the deflection of the diaphragm, which increases an output signal of the pressure sensor. V-grooves can be created on two sides of the pressure sensor and in the cap to create the channel for the fluid in and out of the cap's cavity.
摘要翻译： 一种使用具有介质隔离电气连接的压力传感器的流量传感器装置。 盖可以通过隔膜连接到压力传感器的顶部，以保护接合垫和引线接合与流体介质。 可以在盖上蚀刻流动通道，其开口和出口在盖的侧面上，使得液体可以流过流动通道。 入口和出口可以连接到通道的开口和出口，以允许流体流过隔膜。 流动通道在膜片的部分上产生较大的压力，这增加了膜片的偏转，这增加了压力传感器的输出信号。 可以在压力传感器和盖子的两侧上形成V形槽，以形成流体进出盖体腔体的通道。
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7.发明授权Secondary coating compositions for glass fibers, glass fibers coated with the same and composites reinforced therewith 失效用于玻璃纤维的二次涂料组合物，用其涂覆的玻璃纤维和用其增强的复合材料
公开(公告)号：US5672641A
公开(公告)日：1997-09-30
申请号：US376998
申请日：1995-01-23
CPC分类号： C03C25/10 , C03C25/40 , Y10T428/2938 , Y10T428/2962 , Y10T428/2964
摘要： The present invention includes aqueous coating compositions adapted to coat a plurality of sized glass fibers, glass fibers coated with the same and composites reinforced with the coated glass fibers. The coating composition includes (a) a polysiloxane having: (1) an alkyl substituent attached through a carbon atom directly to a silicon atom of the polysiloxane; (2) an alkoxy substituent attached through a carbon atom directly to a silicon atom of the polysiloxane, the alkoxy substituent having an alkyl group, an alkyl ether group and a terminal group selected from the group consisting of hydrogen and an alkoxy group having about 1 to about 8 carbon atoms; and (3) endblocking groups independently selected from the group consisting of a phenyl group, an alkyl group having about 1 to about 20 carbon atoms and combinations thereof, wherein the polysiloxane is essentially free of silicon-bonded hydroxy groups and alkoxy groups attached through an oxygen atom directly to a silicon atom of the polysiloxane, and (b) zero to less than about 50 weight percent on a total solids basis of a film-forming material capable of forming a uniform continuous coating on the glass fibers.
摘要翻译： 本发明包括适用于涂覆多个尺寸的玻璃纤维的水性涂料组合物，用其涂覆的玻璃纤维和用涂覆的玻璃纤维增强的复合材料。 涂料组合物包括（a）聚硅氧烷，其具有：（1）通过直接与聚硅氧烷的硅原子连接的碳原子的烷基取代基; （2）通过碳原子直接连接到聚硅氧烷的硅原子上的烷氧基取代基，具有烷基，烷基醚基和选自氢和具有约1个碳原子的烷氧基的末端的烷氧基取代基 至约8个碳原子; 和（3）独立地选自苯基，具有约1至约20个碳原子的烷基及其组合的封端基团，其中所述聚硅氧烷基本上不含与硅键合的羟基和通过 氧原子直接连接到聚硅氧烷的硅原子上，和（b）在能够在玻璃纤维上形成均匀连续涂层的成膜材料的基于固体的基础上为零至小于约50重量％。
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公开(公告)号：US20140332917A1
公开(公告)日：2014-11-13
申请号：US13890462
申请日：2013-05-09
申请人： Jason Chilcote , Richard Alan Davis
发明人： Jason Chilcote , Richard Alan Davis
IPC分类号： G01R33/09
CPC分类号： G01R33/09 , G01R33/0052 , H01L27/22 , H01L43/02 , H01L43/08
摘要： Apparatus and associated methods may relate to Magneto-Resistive Sensing Devices (MRSDs). In accordance with an exemplary embodiment, an MRSD comprises an underlying semiconductor device and a magneto-resistive sensor. In some exemplary embodiments, the semiconductor device is processed through most of a standard process flow. After the standard process flow, in various embodiments, a planarization step may be performed to create a more planar top surface. In some embodiments, the magneto-resistive material, which may be made from a Nickel-Iron alloy, called Permalloy, is deposited on the planar surface. A layer of interconnect metallization also may reside in this top region. The magneto-resistive material may contact the topmost layer of metallization of the semiconductor device via contact openings in the planarized surface. In some embodiments, the magneto-resistive material may similarly contact the topmost layer of metallization through these contact openings. The magneto-resistive material resides directly above the underlying circuitry.
摘要翻译： 装置和相关方法可以涉及磁阻检测装置（MRSD）。 根据示例性实施例，MRSD包括底层半导体器件和磁阻传感器。 在一些示例性实施例中，半导体器件通过大部分标准工艺流程进行处理。 在标准工艺流程之后，在各种实施例中，可以执行平面化步骤以创建更平坦的顶表面。 在一些实施例中，可以由镍 - 铁合金制成的称为坡莫合金的磁阻材料沉积在平面上。 互连金属化层也可以驻留在该顶部区域中。 磁阻材料可以通过平坦化表面中的接触开口接触半导体器件的最上层的金属化层。 在一些实施例中，磁阻材料可以类似地通过这些接触开口接触最上层的金属化层。 磁阻材料直接位于底层电路的上方。
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公开(公告)号：US08297125B2
公开(公告)日：2012-10-30
申请号：US12126494
申请日：2008-05-23
CPC分类号： G01L9/0054 , G01L19/0038 , G01L19/147
摘要： A differential pressure sensor includes two pressure ports for allowing media to pass into contact with both the top and bottom sides of the diaphragm. A silicon pressure sensor die can be attached between the pressure ports using die attach materials for sensing a differential pressure between the media to evaluate media differential pressure. A cap with an opening can be placed on topside of a diaphragm formed in the silicon pressure die. The silicon pressure die can include die bond pads that can be electrically connected to the diaphragm to output electrical signals. The cap can seal the die bond pads from the harsh media and route the electrical signals therein. Media can pass through the opening in the cap such that a media path to the top of the diaphragm is not exposed to the die bond pads of the silicon pressure die to ensure long-term sensor reliability.
摘要翻译： 差压传感器包括两个压力端口，用于允许介质与隔膜的顶侧和底侧进行接触。 硅压力传感器模具可以使用管芯附接材料连接在压力端口之间，用于感测介质之间的压差以评估介质压差。 具有开口的盖可以放置在形成在硅压模中的隔膜的上侧。 硅压模可以包括可以与膜片电连接以输出电信号的管芯接合焊盘。 盖可以将密封焊盘从恶劣的介质密封并将电信号传送到其中。 介质可以穿过盖中的开口，使得到隔膜顶部的介质路径不暴露于硅压模的管芯接合焊盘，以确保长期的传感器可靠性。
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公开(公告)号：US20090288492A1
公开(公告)日：2009-11-26
申请号：US12126494
申请日：2008-05-23
CPC分类号： G01L9/0054 , G01L19/0038 , G01L19/147
摘要： A differential pressure sensor includes two pressure ports for allowing media to pass into contact with both the top and bottom sides of the diaphragm. A silicon pressure sensor die can be attached between the pressure ports using die attach materials for sensing a differential pressure between the media to evaluate media differential pressure. A cap with an opening can be placed on topside of a diaphragm formed in the silicon pressure die. The silicon pressure die can include die bond pads that can be electrically connected to the diaphragm to output electrical signals. The cap can seal the die bond pads from the harsh media and route the electrical signals therein. Media can pass through the opening in the cap such that a media path to the top of the diaphragm is not exposed to the die bond pads of the silicon pressure die to ensure long-term sensor reliability.
摘要翻译： 差压传感器包括两个压力端口，用于允许介质与隔膜的顶侧和底侧进行接触。 硅压力传感器模具可以使用管芯附接材料连接在压力端口之间，用于感测介质之间的压差以评估介质压差。 具有开口的盖可以放置在形成在硅压模中的隔膜的上侧。 硅压模可以包括可以与膜片电连接以输出电信号的管芯接合焊盘。 盖可以将密封焊盘从恶劣的介质密封并将电信号传送到其中。 介质可以穿过盖中的开口，使得到隔膜顶部的介质路径不暴露于硅压模的管芯接合焊盘，以确保长期的传感器可靠性。
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