Invention Grant
US08377748B2 Method of manufacturing cooling fin and package substrate with cooling fin
失效
制冷散热片和散热片封装基板的制造方法
- Patent Title: Method of manufacturing cooling fin and package substrate with cooling fin
- Patent Title (中): 制冷散热片和散热片封装基板的制造方法
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Application No.: US13137669Application Date: 2011-09-01
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Publication No.: US08377748B2Publication Date: 2013-02-19
- Inventor: Eung Suek Lee , Je Gwang Yoo , Chang Sup Ryu , Jun Oh Hwang , Jun Heyoung Park , Jee Soo Mok
- Applicant: Eung Suek Lee , Je Gwang Yoo , Chang Sup Ryu , Jun Oh Hwang , Jun Heyoung Park , Jee Soo Mok
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2008-0051003 20080530
- Main IPC: H01L23/467
- IPC: H01L23/467
Abstract:
A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object.
Public/Granted literature
- US20110308069A1 Method of manufacturing cooling fin and package substrate with cooling fin Public/Granted day:2011-12-22
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