公开(公告)号：US08592135B2

公开(公告)日：2013-11-26

申请号：US13403380

申请日：2012-02-23

申请人： Jee Soo Mok ,  Je Gwang Yoo ,  Eung Suek Lee ,  Chang Sup Ryu

发明人： Jee Soo Mok ,  Je Gwang Yoo ,  Eung Suek Lee ,  Chang Sup Ryu

IPC分类号： G03F7/26

CPC分类号： H05K3/4007 ,  B82Y10/00 ,  H05K1/095 ,  H05K2201/026 ,  H05K2201/0367 ,  H05K2203/0514

摘要： A method of manufacturing a printed circuit board, including: applying a conductive paste including carbon nanotubes and a photosensitive binder on a bump-forming area of a circuit substrate having a circuit layer for transferring electrical signals; and patterning the conductive paste, thus forming bumps.

摘要翻译： 一种制造印刷电路板的方法，包括：在具有用于传送电信号的电路层的电路基板的凸起形成区域上涂覆包括碳纳米管和感光性粘合剂的导电浆料; 并图案化导电膏，从而形成凸块。

公开(公告)号：US20120148960A1

公开(公告)日：2012-06-14

申请号：US13403380

申请日：2012-02-23

申请人： Jee Soo Mok ,  Je Gwang Yoo ,  Eung Suek Lee ,  Chang Sup Ryu

发明人： Jee Soo Mok ,  Je Gwang Yoo ,  Eung Suek Lee ,  Chang Sup Ryu

IPC分类号： G03F7/20 ,  B82Y30/00 ,  B82Y40/00

CPC分类号： H05K3/4007 ,  B82Y10/00 ,  H05K1/095 ,  H05K2201/026 ,  H05K2201/0367 ,  H05K2203/0514

摘要： A method of manufacturing a printed circuit board, including: applying a conductive paste including carbon nanotubes and a photosensitive binder on a bump-forming area of a circuit substrate having a circuit layer for transferring electrical signals; and patterning the conductive paste, thus forming bumps.

摘要翻译： 一种制造印刷电路板的方法，包括：在具有用于传送电信号的电路层的电路基板的凸起形成区域上涂覆包括碳纳米管和感光性粘合剂的导电浆料; 并图案化导电膏，从而形成凸块。

公开(公告)号：US20090107709A1

公开(公告)日：2009-04-30

申请号：US12078576

申请日：2008-04-01

申请人： Jee-Soo MOK ,  Je-Gwang YOO ,  Eung-Suek LEE ,  Chang-Sup RYU

发明人： Jee-Soo MOK ,  Je-Gwang YOO ,  Eung-Suek LEE ,  Chang-Sup RYU

IPC分类号： H05K1/09 ,  H05K3/00

CPC分类号： H05K3/4069 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2203/1189 ,  H05K2203/1461 ,  Y10T29/49156

摘要： A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board may include: an insulation layer, a circuit pattern formed on an upper surface and a lower surface of the insulation layer, and a bump penetrating the insulation layer such that the circuit pattern is electrically connected, where an alloy layer, which is configured to increase contact between the circuit pattern and the bump, may be interposed between the bump and the circuit pattern.

摘要翻译： 公开了印刷电路板和印刷电路板的制造方法。 印刷电路板可以包括：绝缘层，形成在绝缘层的上表面和下表面上的电路图案，以及穿透绝缘层的凸块，使得电路图案电连接，其中合金层，其中 配置为增加电路图案和凸块之间的接触，可以插入在凸块和电路图案之间。

公开(公告)号：US20090017275A1

公开(公告)日：2009-01-15

申请号：US12076428

申请日：2008-03-18

申请人： Eung-Suek Lee ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Jun-Oh Hwang ,  Jee-Soo Mok

发明人： Eung-Suek Lee ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Jun-Oh Hwang ,  Jee-Soo Mok

IPC分类号： H05K3/00 ,  B32B3/10

CPC分类号： H05K3/4069 ,  B82Y10/00 ,  H05K1/0206 ,  H05K1/0209 ,  H05K3/06 ,  H05K3/249 ,  H05K3/427 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/026 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/096 ,  Y10T428/24851

摘要： A heat-releasing PCB and a method of manufacturing the PCB are disclosed. The method of manufacturing the heat-releasing printed circuit board includes: preparing a copper clad laminate, which has at least one copper layer stacked on at least one insulation layer; forming a coating layer, made from a paste having carbon nanotubes as a major constituent, on a surface of the copper layer; and forming a circuit pattern by removing portions of the coating layer and portions of the copper layer.

摘要翻译： 公开了一种散热PCB及其制造方法。 制造散热型印刷电路板的方法包括：制备覆铜层压板，其具有至少一层铜层，堆叠在至少一层绝缘层上; 在铜层的表面上形成由具有碳纳米管作为主要成分的浆料制成的涂层; 以及通过去除涂层的一部分和铜层的一部分来形成电路图案。

公开(公告)号：US20080283288A1

公开(公告)日：2008-11-20

申请号：US12219381

申请日：2008-07-21

申请人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

发明人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

IPC分类号： H05K1/11

CPC分类号： H05K3/462 ,  H01R12/523 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0353 ,  Y10T29/49155

摘要： A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.

摘要翻译： 公开了一种使用糊状凸块的印刷电路板及其制造方法。 使用糊状凸块制造印刷电路板的方法包括：（a）穿孔芯板以形成至少一个通孔，（b）通过填充电镀填充至少一个通孔并在其上形成电路图案 芯板的至少一个表面，（c）在芯板的至少一个表面上堆叠焊料凸块，以及（d）在焊料凸块的表面上形成外层电路，结构稳定的全层 由于镀层芯板的BVH的强度增加，可以实现IVH结构，由于并行处理和集体堆叠，制造时间可以减少，由于糊状凸块的铜箔堆叠而实现微电路变得容易 在最外层，可以减少制造成本，因为可以省略某些电镀和钻孔工艺，在电路图案之间增加层间连接面积以提高连接可靠性，并且可以获得凹坑覆盖 d。

公开(公告)号：US08377748B2

公开(公告)日：2013-02-19

申请号：US13137669

申请日：2011-09-01

申请人： Eung Suek Lee ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jun Heyoung Park ,  Jee Soo Mok

发明人： Eung Suek Lee ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jun Heyoung Park ,  Jee Soo Mok

IPC分类号： H01L23/467

CPC分类号： H01L23/373 ,  B82Y30/00 ,  C04B35/80 ,  C04B2235/3217 ,  C04B2235/3418 ,  C04B2235/407 ,  C04B2235/408 ,  C04B2235/5288 ,  F28F3/02 ,  F28F21/02 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/3025 ,  Y10T29/49002 ,  Y10T29/4935 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object.

摘要翻译： 一种冷却翅片和封装基板的制造方法，其特征在于，包括：准备模具，所述模具具有支撑基体和树脂层，所述支撑基部和树脂层形成在所述支撑基部上，并且在其一侧包括凹槽，所述凹槽被构造成形成冷却翅片; 在所述模具的侧面上印刷含有碳成分的可燃性糊料，所述成型体具有形成冷却翅片的所述凹槽; 移除支撑底座以留下冷却物体; 并发射冷却对象。

公开(公告)号：US20120168205A1

公开(公告)日：2012-07-05

申请号：US13422909

申请日：2012-03-16

申请人： Jun-Oh HWANG ,  Jee-Soo Mok ,  Jun-Heyoung Park ,  Kyung-Ah Lee ,  Eung-Suek Lee

发明人： Jun-Oh HWANG ,  Jee-Soo Mok ,  Jun-Heyoung Park ,  Kyung-Ah Lee ,  Eung-Suek Lee

IPC分类号： H05K1/09 ,  H05K1/00

CPC分类号： B82Y10/00 ,  H05K1/0206 ,  H05K1/056 ,  H05K1/183 ,  H05K3/005 ,  H05K3/4069 ,  H05K3/4608 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/0108 ,  H05K2203/1131 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165

摘要： A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board.

摘要翻译： 公开了印刷电路板和印刷电路板的制造方法。 该方法可以包括 提供绝缘层，其中第一金属层形成在绝缘层的一侧上; 在绝缘层上形成凹槽; 在所述槽的内侧和所述绝缘层的另一侧上形成金属物质; 以及通过去除所述第一金属层的一部分，在所述绝缘层的一侧中的至少一个和形成在所述槽上的所述金属物质之间形成第一电路图案。 本发明通过设置与基板直接接触的散热器和印刷电路板的制造方法来提供具有高发热效率的印刷电路板。

公开(公告)号：US20110308069A1

公开(公告)日：2011-12-22

申请号：US13137669

申请日：2011-09-01

申请人： Eung Suek LEE ,  Je Gwang YOO ,  Chang Sup RYU ,  Jun Oh HWANG ,  Jun Heyoung PARK ,  Jee Soo MOK

发明人： Eung Suek LEE ,  Je Gwang YOO ,  Chang Sup RYU ,  Jun Oh HWANG ,  Jun Heyoung PARK ,  Jee Soo MOK

IPC分类号： H05K13/00 ,  C04B35/64

CPC分类号： H01L23/373 ,  B82Y30/00 ,  C04B35/80 ,  C04B2235/3217 ,  C04B2235/3418 ,  C04B2235/407 ,  C04B2235/408 ,  C04B2235/5288 ,  F28F3/02 ,  F28F21/02 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/3025 ,  Y10T29/49002 ,  Y10T29/4935 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object.

摘要翻译： 一种冷却翅片和封装基板的制造方法，其特征在于，包括：准备模具，所述模具具有支撑基体和树脂层，所述支撑基底和树脂层形成在所述支撑基部上，并且在其一侧包括凹槽，所述凹槽被构造成形成冷却翅片; 在所述模具的侧面上印刷含有碳成分的可燃性糊料，所述成型体具有形成冷却翅片的所述凹槽; 移除支撑底座以留下冷却物体; 并发射冷却对象。

公开(公告)号：US07810232B2

公开(公告)日：2010-10-12

申请号：US11976617

申请日：2007-10-25

申请人： Keun-Ho Kim ,  Dek-Gin Yang ,  Jong-Guk Kim ,  II-Kyoon Jeon ,  Eung-Suek Lee

发明人： Keun-Ho Kim ,  Dek-Gin Yang ,  Jong-Guk Kim ,  II-Kyoon Jeon ,  Eung-Suek Lee

IPC分类号： H05K3/36

CPC分类号： H05K3/4641 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/056 ,  H05K3/4069 ,  H05K3/4608 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed circuit board and manufacturing method thereof. A printed circuit board has an insulation substrate, which includes an insulation layer, a circuit pattern formed on one side of the insulation layer, and an interlayer passage joined to the insulation layer and configured to electrically connect with the circuit pattern, and a heat-release layer, which is stacked on the other side of the insulation layer to be stacked on the insulation substrate, can provide a high heat-releasing effect and high bending strength, by means of inner layers or ground layers formed by the heat-release layers.

摘要翻译： 印刷电路板及其制造方法。 印刷电路板具有绝缘基板，该绝缘基板包括绝缘层，形成在绝缘层的一侧的电路图案，以及与该绝缘层接合并被构造为与电路图形电连接的层间通道， 层叠在绝缘层的另一方的层叠在绝缘基板上的剥离层能够通过由散热层形成的内层或接地层提供高散热效果和高弯曲强度 。

公开(公告)号：US20090294739A1

公开(公告)日：2009-12-03

申请号：US12263685

申请日：2008-11-03

申请人： Eung-Suek Lee ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Jun-Oh Hwang ,  Tae-Eun Chang ,  Jee-Soo Mok

发明人： Eung-Suek Lee ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Jun-Oh Hwang ,  Tae-Eun Chang ,  Jee-Soo Mok

IPC分类号： H01B1/02

CPC分类号： H01B1/24 ,  B82Y10/00 ,  H05K1/095 ,  H05K3/4069 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0323 ,  H05K2203/0425

摘要： The invention provides a conductive paste including a carbon nanotube and a printed circuit board using the same. The invention provides the conductive paste which exhibits an excellent electrical conductivity and allows the implementation of the X-Y interconnection and simultaneously the Z-interconnection without loosing the carbon nanotube's own original characteristics.

摘要翻译： 本发明提供一种包括碳纳米管的导电浆料和使用其的印刷电路板。 本发明提供了导电性优异的导电性糊剂，其导电性优异，可以实现X-Y互连，同时实现Z-互连，而不会使碳纳米管本身的原有特性丧失。