发明授权
US08377748B2 Method of manufacturing cooling fin and package substrate with cooling fin
失效
制冷散热片和散热片封装基板的制造方法
- 专利标题： Method of manufacturing cooling fin and package substrate with cooling fin
- 专利标题（中）： 制冷散热片和散热片封装基板的制造方法
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申请号： US13137669申请日： 2011-09-01
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公开(公告)号： US08377748B2公开(公告)日： 2013-02-19
- 发明人: Eung Suek Lee , Je Gwang Yoo , Chang Sup Ryu , Jun Oh Hwang , Jun Heyoung Park , Jee Soo Mok
- 申请人： Eung Suek Lee , Je Gwang Yoo , Chang Sup Ryu , Jun Oh Hwang , Jun Heyoung Park , Jee Soo Mok
- 申请人地址： KR Suwon
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon
- 优先权： KR10-2008-0051003 20080530
- 主分类号： H01L23/467
- IPC分类号： H01L23/467
摘要：
A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object.
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