发明授权
- 专利标题： Dummy wafers in 3DIC package assemblies
- 专利标题（中）： 3DIC封装组件中的虚拟晶圆
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申请号： US12717779申请日： 2010-03-04
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公开(公告)号： US08378480B2公开(公告)日： 2013-02-19
- 发明人: Ming-Fa Chen , Chia-Yen Lee
- 申请人： Ming-Fa Chen , Chia-Yen Lee
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/00
摘要：
A package structure includes a first die, and a second die over and bonded to the first die. The second die has a size smaller than a size of the first die. A dummy chip is over and bonded onto the first die. The dummy chip includes a portion encircling the second die. The dummy chip includes a material selected from the group consisting essentially of silicon and a metal.
公开/授权文献
- US20110215470A1 Dummy Wafers in 3DIC Package Assemblies 公开/授权日：2011-09-08
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