Invention Grant
US08381153B2 Dissection splitting with optical proximity correction and mask rule check enforcement
有权
用光学邻近校正和掩模规则检查执行的解剖分割
- Patent Title: Dissection splitting with optical proximity correction and mask rule check enforcement
- Patent Title (中): 用光学邻近校正和掩模规则检查执行的解剖分割
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Application No.: US12884442Application Date: 2010-09-17
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Publication No.: US08381153B2Publication Date: 2013-02-19
- Inventor: Chia-Ping Chiang , Yu-Po Tang , Ming-Hui Chih , Cheng-Kun Tsai , Wei-Long Wang , Wen-Chun Huang , Ru-Gun Liu , Tsai-Sheng Gau , Cheng-Lung Tsai , Josh J. H. Feng , Bing-Syun Yeh , Jeng-Shiun Ho , Cheng-Cheng Kuo
- Applicant: Chia-Ping Chiang , Yu-Po Tang , Ming-Hui Chih , Cheng-Kun Tsai , Wei-Long Wang , Wen-Chun Huang , Ru-Gun Liu , Tsai-Sheng Gau , Cheng-Lung Tsai , Josh J. H. Feng , Bing-Syun Yeh , Jeng-Shiun Ho , Cheng-Cheng Kuo
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
The present disclosure provides one embodiment of an integrated circuit (IC) design method. The method includes receiving an IC design layout having a plurality of main features; applying a main feature dissection to the main features of the IC design layout and generating sub-portions of the main features; performing an optical proximity correction (OPC) to the main features; performing a mask rule check (MRC) to a main feature of the IC design layout; and modifying one of the sub-portions of the main feature if the main feature fails the MRC.
Public/Granted literature
- US20120072874A1 DISSECTION SPLITTING WITH OPTICAL PROXIMITY CORRECTION AND MASK RULE CHECK ENFORCEMENT Public/Granted day:2012-03-22
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