发明授权
US08381962B2 Injection molded solder method for forming solder bumps on substrates
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用于在基板上形成焊料凸块的注塑焊接方法
- 专利标题： Injection molded solder method for forming solder bumps on substrates
- 专利标题（中）： 用于在基板上形成焊料凸块的注塑焊接方法
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申请号： US13025419申请日： 2011-02-11
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公开(公告)号： US08381962B2公开(公告)日： 2013-02-26
- 发明人: Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah , Kazushige Toriyama
- 申请人： Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah , Kazushige Toriyama
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Ryan, Mason & Lewis, LLP
- 代理商 Daniel P. Morris
- 主分类号： B23K1/00
- IPC分类号： B23K1/00 ; B23K37/00
摘要：
A flexible unitary mask has a plurality of through holes. A substrate has a plurality of wettable pads in recessed regions defining volumes. The through holes are aligned with the wettable pads. Molten solder is directly injected through the through holes of the flexible unitary mask into the volumes with the wettable pads, such that the through holes and the volumes with the wettable pads are filled with solder. The solder is allowed to solidify, forming a plurality of solder structures adhered to the wettable pads. The flexible unitary mask is peeled from the substrate after the solder has solidified.
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