发明授权
US08381967B1 Bonding a solder bump to a lead using compression and retraction forces
有权
使用压缩和收缩力将焊料凸点焊接到引线上
- 专利标题： Bonding a solder bump to a lead using compression and retraction forces
- 专利标题（中）： 使用压缩和收缩力将焊料凸点焊接到引线上
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申请号： US13343941申请日： 2012-01-05
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公开(公告)号： US08381967B1公开(公告)日： 2013-02-26
- 发明人: Mutsumi Masumoto , Jesus Bajo Bautista, Jr. , Raymond Maldan Partosa , James Raymond Baello
- 申请人： Mutsumi Masumoto , Jesus Bajo Bautista, Jr. , Raymond Maldan Partosa , James Raymond Baello
- 申请人地址： US TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： US TX Dallas
- 代理商 Steven A. Shaw; W. James Brady; Frederick J. Telecky, Jr.
- 主分类号： B23K31/02
- IPC分类号： B23K31/02
摘要：
Methods of connecting solder bumps located on dies to leads located on substrates are disclosed herein. One embodiment includes applying a first compression force between the solder bump and the lead; relieving the first compression force between the solder bump and the lead; and applying a second compression force between the solder bump and the lead.
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