Invention Grant
- Patent Title: Semiconductor light-emitting device
- Patent Title (中): 半导体发光装置
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Application No.: US13238818Application Date: 2011-09-21
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Publication No.: US08384109B2Publication Date: 2013-02-26
- Inventor: Eiji Muramoto , Shinya Nunoue
- Applicant: Eiji Muramoto , Shinya Nunoue
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-170967 20080630
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L21/00

Abstract:
A semiconductor light-emitting device including a substrate, an n-type semiconductor layer formed on the substrate, an active layer laminated on the n-type semiconductor layer and capable of emitting a light, a p-type semiconductor layer laminated on the active layer, an n-electrode which is disposed on a lower surface of the semiconductor substrate or on the n-type semiconductor layer and spaced away from the active layer and p-type semiconductor layer, and a p-electrode which is disposed on the p-type semiconductor layer and includes a reflective ohmic metal layer formed on the dot-like metallic layer, wherein the light emitted from the active layer is extracted externally from the substrate side.
Public/Granted literature
- US20120007047A1 SEMICONDUCTOR LIGHT-EMITTING DEVICE Public/Granted day:2012-01-12
Information query
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