Invention Grant
- Patent Title: MEMS device including an electrical interconnect through a substrate
- Patent Title (中): MEMS器件包括通过衬底的电互连
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Application No.: US13455494Application Date: 2012-04-25
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Publication No.: US08384134B2Publication Date: 2013-02-26
- Inventor: Michael J. Daneman , Steven S. Nasiri , Martin Lim
- Applicant: Michael J. Daneman , Steven S. Nasiri , Martin Lim
- Applicant Address: US CA Sunnyvale
- Assignee: Invensense, Inc.
- Current Assignee: Invensense, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Sawyer Law Group, P.C.
- Main IPC: H01L27/148
- IPC: H01L27/148 ; H01L29/84 ; H01L21/00
Abstract:
A MEMS device is disclosed. The MEMS device comprises a MEMS substrate and a CMOS substrate having a front surface, a back surface and one or more metallization layers. The front surface being bonded to the MEMS substrate. The MEMS device includes one or more conductive features on the back surface of the CMOS substrate and electrical connections between the one or more metallization layers and the one or more conductive features.
Public/Granted literature
- US20120235297A1 WAFER LEVEL PACKAGING OF MEMS DEVICES Public/Granted day:2012-09-20
Information query
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