Invention Grant
- Patent Title: Solid-state imager, method of manufacturing the same, and camera
- Patent Title (中): 固态成像仪,制造方法和相机
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Application No.: US12619292Application Date: 2009-11-16
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Publication No.: US08384817B2Publication Date: 2013-02-26
- Inventor: Hideshi Abe
- Applicant: Hideshi Abe
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JP2008-293314 20081117; JP2009-060761 20090313
- Main IPC: H04N5/225
- IPC: H04N5/225 ; G02B13/16

Abstract:
A solid-state imager includes a photoelectric conversion region for photoelectrically converting a light beam received on a light receiving surface thereof into a signal charge and a waveguide path for guiding the light beam to the light receiving surface. The waveguide path includes a plurality of waveguide members, each waveguide member guiding a light beam incident on a light incident surface thereof to a light output surface thereof. The plurality of waveguide members are laminated on the light receiving surface. A first waveguide member closest to the light receiving surface from among the plurality of waveguide members faces the light receiving surface and is smaller in area than a light incident surface of a second waveguide member farthest from the light receiving surface from among the plurality of waveguide members.
Public/Granted literature
- US20100123811A1 SOLID-STATE IMAGER, METHOD OF MANUFACTURING THE SAME, AND CAMERA Public/Granted day:2010-05-20
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