- 专利标题： Chip on wafer bonder
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申请号： US12054097申请日： 2008-03-24
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公开(公告)号： US08387674B2公开(公告)日： 2013-03-05
- 发明人: Chen-Hua Yu , Jui-Pin Hung , Weng-Jin Wu , Jean Wang , Wen-Chih Chiou
- 申请人： Chen-Hua Yu , Jui-Pin Hung , Weng-Jin Wu , Jean Wang , Wen-Chih Chiou
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Comany, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Comany, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Haynes and Boone, LLP
- 主分类号： B29C65/00
- IPC分类号： B29C65/00
摘要：
The present disclosure provides a bonding apparatus. The bonding apparatus includes a cleaning module designed for cleaning chips; and a chip-to-wafer bonding chamber configured to receive the chips from the cleaning module and designed for bonding the chips to a wafer.
公开/授权文献
- US20090142903A1 CHIP ON WAFER BONDER 公开/授权日：2009-06-04
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