发明授权
- 专利标题： Patch on interposer assembly and structures formed thereby
- 专利标题（中）： 内插器组件的补片和由此形成的结构
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申请号： US12655588申请日： 2009-12-31
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公开(公告)号： US08389337B2公开(公告)日： 2013-03-05
- 发明人: Brent M. Roberts , Mihir K. Roy , Sriram Srinivasan
- 申请人： Brent M. Roberts , Mihir K. Roy , Sriram Srinivasan
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Winkle, PLLC
- 主分类号： H01L23/60
- IPC分类号： H01L23/60
摘要：
Methods of forming microelectronic structures are described. Embodiments of those methods include attaching a patch structure to an interposer by thermal compression bonding, forming an underfill around an array of interconnect structures disposed on a top surface of the interposer, curing the underfill, and then attaching a die to the patch structure.
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