Invention Grant
- Patent Title: Gate etch optimization through silicon dopant profile change
- Patent Title (中): 栅极蚀刻优化通过硅掺杂剂轮廓变化
-
Application No.: US13353013Application Date: 2012-01-18
-
Publication No.: US08390042B2Publication Date: 2013-03-05
- Inventor: Man Fai Ng , Rohit Pal
- Applicant: Man Fai Ng , Rohit Pal
- Applicant Address: KY Grand Cayman
- Assignee: Globalfoundries Inc.
- Current Assignee: Globalfoundries Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Ditthavong Mori & Steiner, P.C.
- Main IPC: H01L29/43
- IPC: H01L29/43 ; H01L29/78

Abstract:
Improved semiconductor devices including metal gate electrodes are formed with reduced performance variability by reducing the initial high dopant concentration at the top portion of the silicon layer overlying the metal layer. Embodiments include reducing the dopant concentration in the upper portion of the silicon layer, by implanting a counter-dopant into the upper portion of the silicon layer, removing the high dopant concentration portion and replacing it with undoped or lightly doped silicon, and applying a gettering agent to the upper surface of the silicon layer to form a thin layer with the gettered dopant, which layer can be removed or retained.
Public/Granted literature
- US20120119308A1 GATE ETCH OPTIMIZATION THROUGH SILICON DOPANT PROFILE CHANGE Public/Granted day:2012-05-17
Information query
IPC分类: