Invention Grant
US08391017B2 Thin-film capacitor structures embedded in semiconductor packages and methods of making
有权
半导体封装中嵌入的薄膜电容器结构和制造方法
- Patent Title: Thin-film capacitor structures embedded in semiconductor packages and methods of making
- Patent Title (中): 半导体封装中嵌入的薄膜电容器结构和制造方法
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Application No.: US12763433Application Date: 2010-04-20
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Publication No.: US08391017B2Publication Date: 2013-03-05
- Inventor: David Ross McGregor , Cheong-Wo Hunter Chan , Lynne E. Dellis , Fuhan Liu , Deepukumar M. Nair , Venkatesh Sundaram
- Applicant: David Ross McGregor , Cheong-Wo Hunter Chan , Lynne E. Dellis , Fuhan Liu , Deepukumar M. Nair , Venkatesh Sundaram
- Applicant Address: US GA Atlanta
- Assignee: Georgia Tech Research Corporation
- Current Assignee: Georgia Tech Research Corporation
- Current Assignee Address: US GA Atlanta
- Agency: Thomas | Horstemeyer, LLP
- Main IPC: H01L29/86
- IPC: H01L29/86 ; H01L21/768 ; H01L21/50 ; H01L23/522
Abstract:
Provided are semiconductor packages comprising at least one thin-film capacitor attached to a printed wiring board core through build-up layers, wherein a first electrode of the thin-film capacitor comprises a thin nickel foil, a second electrode of the thin-film capacitor comprises a copper electrode, and a copper layer is formed on the nickel foil. The interconnections between the thin-film capacitor and the semiconductor device provide a low inductance path to transfer charge to and from the semiconductor device. Also provided are methods for fabricating such semiconductor packages.
Public/Granted literature
- US20100270645A1 THIN-FILM CAPACITOR STRUCTURES EMBEDDED IN SEMICONDUCTOR PACKAGES AND METHODS OF MAKING Public/Granted day:2010-10-28
Information query
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