Invention Grant
- Patent Title: Hermetic surface mounted power package
- Patent Title (中): 密封表面贴装电源封装
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Application No.: US11042986Application Date: 2005-01-25
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Publication No.: US08395253B2Publication Date: 2013-03-12
- Inventor: Weidong Zhuang
- Applicant: Weidong Zhuang
- Applicant Address: US CA El Segundo
- Assignee: International Rectifier Corporation
- Current Assignee: International Rectifier Corporation
- Current Assignee Address: US CA El Segundo
- Agency: Farjami & Farjami LLP
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/04
Abstract:
A semiconductor package which includes a substrate formed from AlN and electrical terminals formed from tungsten on at least one surface of the substrate by bulk metallization to serve as electrical connection to a component within the package.
Public/Granted literature
- US20050161786A1 Hermetic surface mounted power package Public/Granted day:2005-07-28
Information query
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