发明授权
- 专利标题: Package-on-package assembly with wire bond vias
- 专利标题(中): 带导线通孔的封装封装组件
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申请号: US13404458申请日: 2012-02-24
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公开(公告)号: US08404520B1公开(公告)日: 2013-03-26
- 发明人: Ellis Chau , Reynaldo Co , Roseann Alatorre , Philip Damberg , Wei-Shun Wang , Se Young Yang
- 申请人: Ellis Chau , Reynaldo Co , Roseann Alatorre , Philip Damberg , Wei-Shun Wang , Se Young Yang
- 申请人地址: US CA San Jose
- 专利权人: Invensas Corporation
- 当前专利权人: Invensas Corporation
- 当前专利权人地址: US CA San Jose
- 代理机构: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- 主分类号: H01L21/60
- IPC分类号: H01L21/60 ; H01L21/603 ; H01L23/488 ; H01L23/49
摘要:
A microelectronic package can include wire bonds having bases bonded to respective ones of conductive elements exposed at a surface of a substrate. The wire bonds may have exterior edge surfaces disposed at an angle between 25° and 92° relative to the bases, and ends remote, e.g., opposite, from the bases, and remote from the ends which are connected to the bases. A dielectric encapsulation layer extends from the substrate and covers portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the encapsulation layer, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds that are uncovered by the encapsulation layer, the unencapsulated portions including the ends of the wire bonds.
公开/授权文献
- US20130095610A1 PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS 公开/授权日:2013-04-18