发明授权
US08404562B2 Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core
有权
具有石墨芯的复合晶片的制造方法以及具有石墨芯的复合晶片
- 专利标题: Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core
- 专利标题(中): 具有石墨芯的复合晶片的制造方法以及具有石墨芯的复合晶片
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申请号: US12894344申请日: 2010-09-30
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公开(公告)号: US08404562B2公开(公告)日: 2013-03-26
- 发明人: Rudolf Berger , Hermann Gruber , Wolfgang Lehnert , Guenther Ruhl , Raimund Foerg , Anton Mauder , Hans-Joachim Schulze
- 申请人: Rudolf Berger , Hermann Gruber , Wolfgang Lehnert , Guenther Ruhl , Raimund Foerg , Anton Mauder , Hans-Joachim Schulze
- 申请人地址: DE Neubiberg
- 专利权人: Infineon Technologies AG
- 当前专利权人: Infineon Technologies AG
- 当前专利权人地址: DE Neubiberg
- 代理机构: Murphy, Bilak & Homiller, PLLC
- 主分类号: H01L21/322
- IPC分类号: H01L21/322 ; H01L21/00 ; H01L21/31
摘要:
According to an embodiment, a composite wafer includes a carrier substrate having a graphite core and a monocrystalline semiconductor layer attached to the carrier substrate.