发明授权
- 专利标题： Chip package with channel stiffener frame
- 专利标题（中）： 带通道加强筋的芯片封装
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申请号： US13158048申请日： 2011-06-10
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公开(公告)号： US08405187B2公开(公告)日： 2013-03-26
- 发明人: Eric Tosaya , Jun Zhai , Chia-Ken Leong , Tom Ley
- 申请人： Eric Tosaya , Jun Zhai , Chia-Ken Leong , Tom Ley
- 申请人地址： KY Grand Cayman
- 专利权人： Globalfoundries Inc.
- 当前专利权人： Globalfoundries Inc.
- 当前专利权人地址： KY Grand Cayman
- 代理机构： Ditthavong Mori & Steiner, P.C.
- 主分类号： H01L29/00
- IPC分类号： H01L29/00
摘要：
Various semiconductor chip packages and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a substrate that has a first side and a first plurality of passive devices on the first side. A stiffener frame is coupled on the first side. The stiffener frame has first and second spaced apart opposing walls that define a channel in which the first plurality of passive devices is positioned, and a central opening that does not cover a central portion of the first side of the substrate.
公开/授权文献
- US20110241161A1 CHIP PACKAGE WITH CHANNEL STIFFENER FRAME 公开/授权日：2011-10-06
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