发明授权
- 专利标题： Mounted structure
- 专利标题（中）： 安装结构
-
申请号： US12260219申请日： 2008-10-29
-
公开(公告)号： US08410377B2公开(公告)日： 2013-04-02
- 发明人: Atsushi Yamaguchi , Hidenori Miyakawa , Shigeaki Sakatani , Koso Matsuno
- 申请人： Atsushi Yamaguchi , Hidenori Miyakawa , Shigeaki Sakatani , Koso Matsuno
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Steptoe & Johnson LLP
- 优先权： JP2007-284976 20071101
- 主分类号： H01L23/28
- IPC分类号： H01L23/28
摘要：
A plurality of semiconductor elements is adjacently mounted on a substrate by a solder with a melting point of 200° C. or lower, an electronic part other than the semiconductor elements is mounted on the substrate between the adjacently mounted semiconductor elements by a solder with a melting point of 200° C. or lower, and spaces between the plurality of semiconductor elements and the substrate, spaces between the electronic part and the substrate, and spaces between the plurality of semiconductor elements and the electronic part are integrally molded with a molding resin.
公开/授权文献
- US20090116205A1 MOUNTED STRUCTURE 公开/授权日：2009-05-07