Invention Grant
- Patent Title: Electromigration reduction in micro-hotplates
- Patent Title (中): 微电镀减少电镀
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Application No.: US12691104Application Date: 2010-01-21
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Publication No.: US08410560B2Publication Date: 2013-04-02
- Inventor: Syed Zeeshan Ali , Florin Udrea , Julian William Gardner
- Applicant: Syed Zeeshan Ali , Florin Udrea , Julian William Gardner
- Applicant Address: GB Cambridge
- Assignee: Cambridge CMOS Sensors Ltd.
- Current Assignee: Cambridge CMOS Sensors Ltd.
- Current Assignee Address: GB Cambridge
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L21/00
Abstract:
A micro-hotplate is provided in the form of a device comprising a sensor and one or more resistive heaters within the micro-hotplate arranged to heat the sensor. Furthermore a controller is provided for applying a bidirectional drive current to at least one of the heaters to reduce electromigration. The controller also serves to drive the heater at a substantially constant temperature.
Public/Granted literature
- US20110174799A1 MICRO-HOTPLATES Public/Granted day:2011-07-21
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