发明授权
- 专利标题: Predictive modeling of interconnect modules for advanced on-chip interconnect technology
- 专利标题(中): 用于先进片上互连技术的互连模块的预测建模
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申请号: US12474297申请日: 2009-05-29
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公开(公告)号: US08429577B2公开(公告)日: 2013-04-23
- 发明人: Xia Li , Wei Zhao , Yu Cao , Shiqun Gu , Seung H. Kang , Matthew Nowak
- 申请人: Xia Li , Wei Zhao , Yu Cao , Shiqun Gu , Seung H. Kang , Matthew Nowak
- 申请人地址: US CA San Diego
- 专利权人: QUALCOMM Incorporated
- 当前专利权人: QUALCOMM Incorporated
- 当前专利权人地址: US CA San Diego
- 代理商 Michelle Gallardo
- 主分类号: G06F9/455
- IPC分类号: G06F9/455 ; G06F17/50
摘要:
A computer program product estimates performance of an interconnect structure of a semiconductor integrated circuit (IC). The program product includes code executing on a computer to calculate at least one electrical characteristic of the interconnect structure based on input data accounting for multiple layers of the interconnect structure. The electrical characteristics can be capacitance, resistance, and/or inductance. The capacitance may be based upon multiple components, including a fringe capacitance component, a terminal capacitance component, and a coupling capacitance component.