发明授权
- 专利标题： Heat treatment for a panel and apparatus for carrying out the heat treatment method
- 专利标题（中）： 用于实施热处理方法的面板和设备的热处理
-
申请号： US11581060申请日： 2006-10-16
-
公开(公告)号： US08431063B2公开(公告)日： 2013-04-30
- 发明人: Gottfried Beer , Markus Brunnbauer , Edward Fuergut
- 申请人： Gottfried Beer , Markus Brunnbauer , Edward Fuergut
- 申请人地址： DE Neubiberg
- 专利权人： Intel Mobile Communications GmbH
- 当前专利权人： Intel Mobile Communications GmbH
- 当前专利权人地址： DE Neubiberg
- 代理机构： Eschweiler & Associates, LLC
- 优先权： DE102005049977 20051017
- 主分类号： B29B17/00
- IPC分类号： B29B17/00
摘要：
A heat treatment method is provided for a panel. The panel includes a plastic housing composition, in which semiconductor chips are embedded by their rear sides and edge sides, and the top sides of the semiconductor chips form a coplanar area with the plastic housing composition. The panel is fixed by its underside on a holder, and a temperature gradient (ΔT) is then generated between top side and the underside of the panel. The temperature gradient (ΔT) is then maintained for at least one delimited or selected time period. The panel is then cooled to room temperature (TR).
公开/授权文献
信息查询
