Invention Grant
- Patent Title: Backside illuminated imaging sensor with reinforced pad structure
- Patent Title (中): 带加强垫结构的背面照明成像传感器
-
Application No.: US13554490Application Date: 2012-07-20
-
Publication No.: US08431429B2Publication Date: 2013-04-30
- Inventor: Hsin-Chih Tai , Howard E. Rhodes , Duli Mao , Vincent Venezia , Yin Qian
- Applicant: Hsin-Chih Tai , Howard E. Rhodes , Duli Mao , Vincent Venezia , Yin Qian
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Main IPC: H01L31/14
- IPC: H01L31/14
Abstract:
A method of fabricating a backside illuminated imaging sensor that includes a device layer, a metal stack, and an opening is disclosed. The device layer has an imaging array formed in a front side of the device layer, where the imaging array is adapted to receive light from a back side of the device layer. The metal stack is coupled to the front side of the device layer and includes at least one metal interconnect layer having a metal pad. The opening extends from the back side of the device layer to the metal pad to expose the metal pad for wire bonding. The method includes depositing a film on the back side of the device layer and within the opening, then etching the film to form a frame within the opening to structurally reinforce the metal pad.
Public/Granted literature
- US20120282728A1 BACKSIDE ILLUMINATED IMAGING SENSOR WITH REINFORCED PAD STRUCTURE Public/Granted day:2012-11-08
Information query
IPC分类:
