发明授权
- 专利标题： Polyamide resin composition
- 专利标题（中）： 聚酰胺树脂组合物
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申请号： US13338350申请日： 2011-12-28
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公开(公告)号： US08431636B2公开(公告)日： 2013-04-30
- 发明人: Sang Hwa Lee , In Sik Shim , In Geol Baek , Pil Ho Kim , Jong Cheol Lim
- 申请人： Sang Hwa Lee , In Sik Shim , In Geol Baek , Pil Ho Kim , Jong Cheol Lim
- 申请人地址： KR Gumi-si
- 专利权人： Cheil Industries Inc.
- 当前专利权人： Cheil Industries Inc.
- 当前专利权人地址： KR Gumi-si
- 代理机构： Summa, Additon & Ashe, P.A.
- 优先权： KR10-2010-0136324 20101228; KR10-2011-0142044 20111226
- 主分类号： C08K5/17
- IPC分类号： C08K5/17 ; C08K3/22 ; C08K3/30 ; C08K3/26
摘要：
A polyamide resin composition according to the present invention comprises (A) crystalline polyamide resin having a glass transition temperature (Tg) of about 50 to about 100° C.; (B) crystalline polyamide resin having a glass transition temperature (Tg) of about 110 to about 160° C.; (C) inorganic filler; (D) white pigment; and (E) light stabilizer, and can have excellent surface gloss, surface reflectance, heat resistance, mechanical strength, moldability, light stability and discoloration resistance.
公开/授权文献
- US20120165445A1 Polyamide Resin Composition 公开/授权日：2012-06-28
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