- 专利标题: Semiconductor device and a method of manufacturing the same
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申请号: US13587008申请日: 2012-08-16
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公开(公告)号: US08431978B2公开(公告)日: 2013-04-30
- 发明人: Yoshiyuki Kawashima , Koichi Toba , Yasushi Ishii , Toshikazu Matsui , Takashi Hashimoto
- 申请人: Yoshiyuki Kawashima , Koichi Toba , Yasushi Ishii , Toshikazu Matsui , Takashi Hashimoto
- 申请人地址: JP Kawaswaki-shi
- 专利权人: Renesas Electronics Corporation
- 当前专利权人: Renesas Electronics Corporation
- 当前专利权人地址: JP Kawaswaki-shi
- 代理机构: Miles & Stockbridge P.C.
- 优先权: JP2007-267398 20071015
- 主分类号: H01L27/08
- IPC分类号: H01L27/08
摘要:
In connection with a semiconductor device including a capacitor element there is provided a technique capable of improving the reliability of the capacitor element. A capacitor element is formed in an element isolation region formed over a semiconductor substrate. The capacitor element includes a lower electrode and an upper electrode formed over the lower electrode through a capacitor insulating film. Basically, the lower electrode and the upper electrode are formed from polysilicon films and a cobalt silicide film formed over the surfaces of the polysilicon films. End portions of the cobalt silicide film formed over the upper electrode are spaced apart a distance from end portions of the upper electrode. Besides, end portions of the cobalt silicide film formed over the lower electrode are spaced apart a distance from boundaries between the upper electrode and the lower electrode.
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