发明授权
- 专利标题: Methods of processing substrates having metal materials
- 专利标题(中): 处理具有金属材料的基板的方法
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申请号: US13014813申请日: 2011-01-27
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公开(公告)号: US08435419B2公开(公告)日: 2013-05-07
- 发明人: Guowen Ding , Herrick Ng , Teh-Tien Sue , Benjamin Schwarz , Zhuang Li
- 申请人: Guowen Ding , Herrick Ng , Teh-Tien Sue , Benjamin Schwarz , Zhuang Li
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Moser Taboada
- 代理商 Alan Taboada
- 主分类号: C23F1/00
- IPC分类号: C23F1/00
摘要:
Methods of processing substrates having metal layers are provided herein. In some embodiments, a method of processing a substrate comprising a metal layer having a patterned mask layer disposed above the metal layer, the method may include etching the metal layer through the patterned mask layer; and removing the patterned mask layer using a first plasma formed from a first process gas comprising oxygen (O2) and a carbohydrate. In some embodiments, a two step method with an additional second process gas comprising chlorine (Cl2) or a sulfur (S) containing gas, may provide an efficient way to remove patterned mask residue.
公开/授权文献
- US20110306215A1 METHODS OF PROCESSING SUBSTRATES HAVING METAL MATERIALS 公开/授权日:2011-12-15