Invention Grant
- Patent Title: Tin electroplating bath, tin plating film, tin electroplating method, and electronic device component
- Patent Title (中): 锡电镀浴，镀锡膜，锡电镀法和电子元器件
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Application No.: US12282483Application Date: 2007-04-06
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Publication No.: US08440066B2Publication Date: 2013-05-14
- Inventor: Isamu Yanada , Masanobu Tsujimoto
- Applicant: Isamu Yanada , Masanobu Tsujimoto
- Applicant Address: JP Osaka-Shi
- Assignee: C. Uyemura & Co., Ltd.
- Current Assignee: C. Uyemura & Co., Ltd.
- Current Assignee Address: JP Osaka-Shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2006-111702 20060414
- International Application: PCT/JP2007/057732 WO 20070406
- International Announcement: WO2007/119691 WO 20071025
- Main IPC: C25D3/60
- IPC: C25D3/60 ; C25D3/30 ; C25D3/32 ; C23C16/40
Abstract:
Disclosed is a tin electroplating bath containing a water-soluble tin salt, one or more substances selected from inorganic acids, organic acids and their water-soluble salts, and one or more substances selected from water-soluble tungsten salts, water-soluble molybdenum salts and water-soluble manganese salts. This tin electroplating bath enables to form a tin-plated coating film on components for electronic devices such as a chip component, crystal oscillator, bump, connector, lead frame, hoop member, semiconductor package and printed board, as a substitute for a tin-lead alloy plating material, while having high whisker suppressing effects.
Public/Granted literature
- US20090098398A1 TIN ELECTROPLATING BATH, TIN PLATING FILM, TIN ELECTROPLATING METHOD, AND ELECTRONIC DEVICE COMPONENT Public/Granted day:2009-04-16
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